A high heat dissipation laser device

Abstract

The present invention relates to the field of laser devices, and provides a high heat dissipation laser device. The laser device includes a substrate, the substrate has a first surface and a second surface oppositely arranged, the substrate is provided with at least one accommodation groove penetrating the substrate, and the accommodation groove It includes a groove wall, the end of the groove wall close to the first surface is recessed to form a first positioning step; the laser device also includes a laser chip housed in the receiving groove and a metal radiator electrically connected to the non-light-emitting surface of the laser chip; the first The positioning step is used to support and fix the laser chip, and the light-emitting surface of the laser chip faces the second surface; the end of the metal radiator close to the laser chip is accommodated in the receiving groove between the plane where the first surface is located and the non-light-emitting surface of the laser chip. inside the space. The high heat dissipation laser device of the present invention can realize that the heat generated when the laser chip is working can be directly exported through the metal heat sink without passing through other media for heat dissipation, so it has relatively excellent heat dissipation performance.

Description

technical field [0001] The invention relates to the field of laser devices, more specifically, to a high heat dissipation laser device. Background technique [0002] High-power semiconductor lasers have high output power and small light-emitting area, and they generate high heat density during operation. When the chip is overheated, the laser is quenched, which will limit the high-power laser output. Good device heat dissipation depends on optimized heat dissipation structure design, packaging material selection (thermal interface material and substrate material), and packaging manufacturing process. At present, the heat dissipation structure of the existing laser device makes there are multiple layers of media between the laser chip and the heat sink, which will reduce the heat dissipation effect, and it is difficult to meet the application in the scene with higher heat dissipation requirements. Therefore, it is urgent to provide a new heat dissipation structure to improve...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a high heat dissipation laser device to solve the problem that the heat dissipation structure of the existing laser device makes it difficult to meet the application in the scene with higher heat dissipation requirements

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