High-power-density integrated PCU module and liquid cooling design method thereof

Abstract

The invention discloses a high-power-density integrated PCU module and a liquid cooling design method thereof. The liquid cooling design method comprises a liquid cooling radiator structure design method and a liquid cooling parameter optimization method. According to the liquid cooling design method, the problem of overheating of a local power chip in the PCU module due to high integration levelof the PCU power module is solved, and optimized heat dissipation of the high-power-density integrated PCU module is realized.

Description

technical field [0001] The invention relates to electronic circuits, in particular to a high power density integrated PCU module and a liquid cooling design method thereof. Background technique [0002] High integration has become the mainstream trend in the development of power control unit (PCU) modules of pure electric vehicle (electrical vehicle, EV) or hybrid electric vehicle (hybrid electrical vehicle, HEV) system power control unit (PCU). The development trend of high integration of PCU modules is mainly reflected in two aspects. One is that more circuit conversion function modules are integrated into the same module, and the other is that more components are integrated into the same module. [0003] For the PCU module of plug-in hybrid electric vehicles, more circuit conversion function modules are integrated into the same module. There are also some typical examples in the industry, such as the PCU module used by Toyota's first-generation Prius. However, when the s...

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Problems solved by technology

[0006] The existing liquid cooling parameter optimization is only based on the optimization design criteria of the maximum temperature and maximum pressure of the coolant limited by the junction temperature of the power chip, and the existing coolant flow rate optimization does not consider the uniqueness of the high power density integrated PCU module power chips thermal resistance characteristics, which makes the designed coolant flow rate deviate from the optimum value

If the flow rate is too high, it will increase the cost of heat dissipation; if the flow rate is too low, there will be a risk of local power chip overheating

In addition, because the difference in thermal resistance of the PCU module is not considered, the coolant flow space design inside the liquid-cooled radiator cavity is not optimized and adjusted in different areas, which will also increase the risk of local chip overheating in the module.

Therefore, the existing liquid cooling design cannot effectively deal with the inconsistent thermal resistance characteristics of the PCU module due to high power density integration, making the designed liquid cooling parameters either too stringent or too slack

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