Wafer anti-sticking device

Abstract

The invention relates to the technical field of wafer processing, and discloses a wafer anti-sticking device which comprises a protective cover, the bottom wall of the protective cover is arranged ina through mode, a lifting assembly is arranged at the bottom of the protective cover, a top shielding plate is arranged above the lifting assembly, and a wafer is placed on a wafer lifting ring. Due to the fact that the heater, the lower clamping ring and the top shielding plate which are arranged on the bottom movable plate make contact with one another at the wafer deposition position, deposition occurs, after film deposition, the bottom movable plate is controlled by the adjusting piece to move downwards, and the heater and the wafer are driven to start to move downwards. Due to the expansion effect of the lower tension spring, the lower clamping rings start to be separated from each other, the lower clamping rings move downwards to create pressing force so as to further move the waferand the top shielding plate to generate a large gap distance, so that the wafer and the top shielding plate are completely separated, the problem of wafer adhesion is solved, the wafer processing effect is improved, and machining requirements of users are met.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a wafer anti-sticking device. Background technique [0002] In the current semiconductor wafer processing industry, a type of metal deposition called metallization physical vapor deposition (PVD) is widely used in the industry as the main core metallization layer deposition required by integrated circuit design. Aluminum alloy, the most commonly used interconnect material in the semiconductor industry, was chosen because of its low electrical resistivity, high corrosion resistance, good adhesion characteristics, and compatibility with semiconductor processing techniques and chemical compositions. Therefore, aluminum is the conductive material of choice in the semiconductor industry. Due to wafer fabrication process requirements, edge exclusion and overlay protection are usually designed and incorporated into metallization physical vapor deposition (PVD) sputtering proce...

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Problems solved by technology

[0003] The object of the present invention is to provide a wafer anti-sticking device to solve the problem in the prior art that during repeated processing, the hardware shield protection kit includes wafer edge protection, which is designed to protect the process chamber and the wafers deposited during the process During the thick film deposition process, a thick layer of material coating is formed on the wafer clamp ring, which creates a shadow effect on the edge of the wafer and causes the problem of wafer sticking on the clamp ring

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