Flash removal device after integrated circuit packaging

Abstract

The invention discloses a flash removal device after integrated circuit packaging, which includes a flash removal support, and is characterized in that a flash removal conveyor belt is installed in the middle of the flash removal support, and a high-pressure water tank is installed on the top of the flash removal support. A flushing box, the interior of the high-pressure water flushing box is equipped with multi-directional high-pressure nozzles, a height sensor is installed on one side of the drying box, one side of the height sensor is electrically connected to the controller, and the overflow removal bracket Manipulator 1 is installed on one side, and packaging support is installed on the other side of described manipulator 1, and packaging conveyer belt is installed in the middle of described packaging support, and secondary reinforcement box is installed on the top of deflashing support, and described secondary reinforcement box telescopic rods are installed on both sides of the telescopic rod, a secondary reinforcement bracket is installed on the top of the telescopic rod, and a packaging box is installed on the top of the packaging bracket. The present invention has the characteristics of strong practicability and secondary reinforcement for integrated circuit packaging .

Description

technical field [0001] The invention relates to the technical field of flash removal devices after integrated circuit packaging, in particular to a flash removal device after integrated circuit packaging. Background technique [0002] In the integrated circuit packaging operation, since the mold clamping of the plastic sealing mold cannot ensure the zero gap between the upper and lower molds, there is overflow of epoxy resin on the edge of the integrated circuit block after packaging. The size of the overflow is different for different packaged products. In order to remove The remaining flash after IC packaging is usually softened by electroplating solution, and then removed by high-pressure water de-flashing equipment. This method is labor-intensive for operators, and the flash removal is not clean, and it will cause residual plastic sealing material on the side of the integrated circuit tube leg, resulting in poor welding of the subsequent integrated circuit and affecting ...

AI Technical Summary

Problems solved by technology

This method is labor-intensive for operators, and the flash removal is not clean, and it will cause residual plastic sealing material on the side of the integrated circuit tube leg, resulting in poor welding of the subsequent integrated circuit and affecting product quality. Therefore, the design is practical and can be used for integrated circuits. It is necessary to remove the overflow device after packaging the integrated circuit with secondary reinforcement

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