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LED core particle packaging method and LED core particle packaging structure

A packaging method and packaging structure technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of uneven brightness and darkness of the core particles in the outer ring, and can not be identified, so as to achieve the effect of providing efficiency, low cost, and reducing alarms

Active Publication Date: 2021-02-09
XIAMEN SANAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to provide a packaging method for LED core particles to solve the problem that the existing outer ring core particles cannot be recognized by the automatic image recognition visual system of the die-bonding machine due to uneven brightness and darkness

Method used

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  • LED core particle packaging method and LED core particle packaging structure
  • LED core particle packaging method and LED core particle packaging structure
  • LED core particle packaging method and LED core particle packaging structure

Examples

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Embodiment 1

[0029] Such as figure 1 with figure 2 shown. in figure 1 It is a schematic diagram of sticking release paper after the core particles are fixed on the film. exist figure 1 Among them, the number 1 represents the adhesive film, 20 represents the non-outermost non-outer ring core particle, 21 represents the outermost outer ring core particle among all the core particles, and 3 represents the release paper.

[0030] figure 2 It is a schematic diagram of non-outer ring core particles 20 and outer ring core particles 21 under the CCD lens of the die bonder. exist figure 2 Among them, the reference number 41 represents the CCD lens of the die bonder, and 42 represents the plate of the die bonder, and the arrow in the figure represents the light path.

[0031] The applicant found in the research that the main reason for the uneven brightness and darkness of the outer ring core particles 21 is that the outer ring core particles 21 are affected by the bonding force of the adh...

Embodiment 2

[0043] refer to Figure 3-Figure 5, this embodiment provides an LED chip packaging structure produced by the LED chip packaging method proposed in Example 1, including an adhesive film, a plurality of LED chips, a cover and a support, wherein a plurality of LED The core particles are fixed on the adhesive film 1, and are divided into outer ring core particles 21 located at the edge and non-outer ring core particles 20 located in the outer ring core particles 21 according to their positional relationship; the support is placed on the adhesive film The core particle is fixed on one side, the support 5 is arranged on the edge of the outermost core particle, and the maximum thickness of the support 5 is greater than the maximum thickness of the core particle;

[0044] The cover covers the support 5 and all the core particles, and is fixed on the adhesive film 1 and / or the support 5, and the support 5 prevents the cover from directly contacting the position of the core particles. ...

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PUM

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Abstract

The invention relates to an LED core particle packaging method and an LED core particle packaging structure, and the method comprises the steps: adding a supporting object between an adhesive film andrelease paper, so that the release paper does not directly make contact with the adhesive film at the position of a core particle, thereby avoiding the inclination of an outer ring core particle caused by the generation of a pressing force, solving the problem that an existing outer ring core particle cannot be recognized by an automatic image recognition visual system of a die bonder due to uneven brightness.

Description

technical field [0001] The invention relates to the field of semiconductor chips, in particular to a packaging method for LED core particles and a packaging structure for LED core particles. Background technique [0002] After the current LED wafer is cut and tested, it will be classified according to the photoelectric parameters such as voltage (VF), wavelength (WLD), optical power (LOP), etc., and the chips with different parameters will be captured by the sorting machine to different film ( tape), currently blue film, white film and UV film are mainly used to fix the core chip. After the chip factory sorts the film, paste the release paper on the film and ship it to the packaging factory for chip fixing, wire bonding and other operations. [0003] As the size of LED chips becomes smaller and smaller, the size of some chips used in mini LED displays is often less than 100um. When the die-bonding machine in the packaging factory picks up the chips, there will be a circle at...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L21/683H01L21/67
CPCH01L33/483H01L21/67132H01L21/6836H01L2221/68313H01L2933/0033
Inventor 卢栋梁林宗民陈明湖林维扬林桂绮曾合加蔡吉明
Owner XIAMEN SANAN OPTOELECTRONICS CO LTD
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