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Wafer baking device

A technology for baking devices and wafers, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as unfavorable pick-and-place processes, wafer fluctuations on the heating plate, slipping or slipping, etc., to overcome defects Influence, improve stability, improve production efficiency

Pending Publication Date: 2021-02-09
芯米(厦门)半导体设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] What the present invention aims to solve is that in the process of raising and lowering the heating plate in the prior art, the heating plate tends to fluctuate and cause the wafer to slip or fall, which is not safe enough and is not conducive to the subsequent pick-and-place process; in addition, the temperature of the heating plate during operation High, more and higher requirements for lifting devices (such as heat resistance, safety, etc.)

Method used

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Embodiment 1

[0050] refer to Figure 1-Figure 3As shown, the present invention provides a wafer baking device, which includes a housing 1 , a heater 2 , an ejection mechanism 3 and a sealing mechanism 4 . Wherein, the shell 1 has an inner cavity 11, and the inner cavity 11 has at least one opening 111, and the opening 111 is used for the entry and exit of the wafer, and the surface of the shell 1 is provided with a lifting guide rail 1211; the heater 2 is arranged in the inner cavity 11 for Carrying and heating the wafer; the ejection mechanism 3 is slidably connected to the lifting guide rail 1211 so as to perform lifting movement along the lifting guide rail 1211, the ejection mechanism 3 has a thimble 32, and the thimble 32 is installed in the heater 2, and the thimble 32 can follow the described Part of the lifting movement extends out of the heater 2; the sealing mechanism 4 is arranged above the heater 2, and is slidably connected to the lifting guide rail 1211 so as to perform lifti...

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Abstract

The invention discloses a wafer baking device which comprises a shell, a sealing mechanism, a heater and an ejection mechanism, the sealing mechanism, the heater and the ejection mechanism are arranged in the shell, a lifting guide rail is arranged on the surface of the shell, and the ejection mechanism and the sealing mechanism are both connected with the lifting guide rail in a sliding mode. Therefore, the lifting motion of the ejection mechanism can be matched with the stable heater to eject a wafer or return a thimble, and the lifting motion of the sealing mechanism is matched with the stable heater to seal or remove the sealing of the heater, so that the adverse effect caused by the lifting of a heating plate in the prior art is overcome; the stability of wafer placement is improved,the safety is good, and subsequent taking and placing procedures are facilitated; and meanwhile, the lifting mechanism is prevented from being directly connected with the heating disc, the requirements for heat resistance, safety and the like of the lifting device are reduced, and the selectivity of the lifting device is widened.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer baking device. Background technique [0002] Integrated circuit wafer production is a series of production processes that create semiconductor devices on and in the surface of the wafer. During this production process, the wafer is heated at various stages. [0003] The wafer baking device usually includes a heating plate, which is used to heat the wafers carried on the upper surface of the heating plate. A sealing mechanism is usually provided above the heating plate to seal and connect the upper surface of the heater to prevent heat loss. The bottom of the heating plate is usually An ejection mechanism is provided for ejecting the wafer after the wafer is baked. However, most of the existing wafer baking devices use the way of raising the heating plate to realize the sealing connection with the sealing mechanism, or lowering the heating plate so that the thimble...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67098
Inventor 许志雄
Owner 芯米(厦门)半导体设备有限公司
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