Structurally optimized integrated circuit package

Abstract

The invention discloses an integrated circuit package with an optimized structure. The package comprises a substrate and is characterized in that three integrated circuit chips, namely a main integrated circuit chip, a first auxiliary integrated circuit chip and a second auxiliary integrated circuit chip, are packaged in the substrate; the two auxiliary integrated circuit chips are consistent in size and distributed on the right side of the substrate side by side, the area of the main integrated circuit chip is larger than that of the two auxiliary integrated circuit chips, two liquid coolingheat dissipation pipes are arranged between the lower portion of the main integrated circuit chip and the top of the substrate, and the two liquid cooling heat dissipation pipes are annularly distributed in total. The liquid cooling heat dissipation pipe is in a cylindrical pipe shape on the periphery of the main integrated circuit chip and is arranged above the substrate in a square surrounding mode, a pipeline, close to one side of the substrate, of the liquid cooling heat dissipation pipe gradually deforms from a cylinder to a flat rectangular state and penetrates through the lower side ofthe main integrated circuit chip, and the liquid cooling heat dissipation pipe has the advantages of being good in heat dissipation performance and high in packaging efficiency.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a structurally optimized integrated circuit package. Background technique [0002] Integrated circuit (integrated circuit) is a kind of miniature electronic device or component. It uses a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit, and interconnects them in one or several small pieces. On semiconductor wafers or dielectric substrates, however, the electronic industry continues to reduce the size of electronic components and continue to increase functions on electronic components, making the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop in the direction of small size, high pin count and high electrical / thermal performance, and conforms to predetermined industrial standards. S...

AI Technical Summary

Problems solved by technology

Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to facilitate heat dissipation and prolong the service life of integrated circuits , the heat dissipation effect of the heat dissipation structure on the existing small package structure is not ideal, and the installation of the package is troublesome, and the package efficiency is low

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