Pressure module and manufacturing method thereof

Abstract

The embodiment of the invention discloses a pressure module and a manufacturing method thereof. The pressure module comprises a circuit substrate, an MEMS chip, an ASIC chip, a first packaging circuitboard, a pouring sealant and a second packaging circuit board. According to the technical scheme provided by the invention, the MEMS chip and the ASIC chip are fused together and arranged in the cavity formed by the circuit substrate, the first packaging circuit board and the second packaging circuit board, and are filled with the pouring sealant, so that the purpose that the chip is sealed without leakage is achieved, the MEMS chip and the ASIC chip can be ensured not to be damaged and not to fall off at a bonding part under high pressure, and the overall structural compactness is improved;in addition, the MEMS chip and the ASIC chip are only used as pressure sensing elements, so that the reliability and the stability of a product are improved, the cost and the manufacturability and assembly cost of the pressure module are reduced, and large-scale automatic production is realized.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor chip packaging, in particular to a pressure module and a manufacturing method thereof. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS for short) is a process technology that integrates microelectronics technology and mechanical engineering, and its operating range is in the micron range. MEMS is a brand-new research and development field that must consider the mixing of multiple physical fields at the same time. Compared with traditional machinery, their size is smaller, the largest is no more than one centimeter, or even only a few microns, and their thickness is even smaller. . Application Specific Integrated Circuit (ASIC for short) is considered as an integrated circuit designed for a special purpose in the integrated circuit industry. [0003] The packaging structure of MEMS chips and ASIC chips has opened up a new technical field and indust...

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Problems solved by technology

[0004] In the prior art, the packaging structure of the MEMS chip and the ASIC chip in the general sensor module is to directly attach and fix the two relative to each other through adhesive layer bonding or welding. In this way, during the use of the sensor module, there will be leakage of the chip seal. Especially in the case of high working pressure, it is easy to damage the MEMS chip. The MEMS chip cannot bear the high pressure and the bonding will fall off, and it will be accompanied by the possibility of signal interruption, which will affect the reliability of the system, and the follow-up maintenance cost will be too high. high

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