Laminating device for semiconductor preparation
A semiconductor and layer-using technology, which is applied in the field of lamination devices for semiconductor preparation, can solve problems such as low work efficiency and slow lamination speed, and achieve the effects of improving work efficiency, prolonging service life, and ensuring stability
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[0056] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0057] see Figure 1-5 , the present invention provides a technical solution: a lamination device for semiconductor preparation, including a base plate 1, a U-shaped support plate 2 is fixedly connected to the middle of the upper surface of the base plate 1, and a drive motor is arranged in the middle of the lower surface of the U-shaped support plate 2 3. The model of the drive motor 3 is Y112M-2, the middle part of the upper surface of the U-shaped support p...
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