Chemical mechanical polishing device and chemical mechanical polishing method

A chemical machinery and grinding device technology, applied in grinding devices, grinding machine tools, grinding drive devices, etc., can solve problems such as imperfect functions, materials that cannot be automatically transported out of the equipment, and inconvenient to use.

Inactive Publication Date: 2021-01-15
德清世锦智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing technology has the problems of imperfect function and inconvenient use, and the finished materials cannot be automatically transported out of the equipment

Method used

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  • Chemical mechanical polishing device and chemical mechanical polishing method
  • Chemical mechanical polishing device and chemical mechanical polishing method
  • Chemical mechanical polishing device and chemical mechanical polishing method

Examples

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0032] Examples of the described embodiments are shown in the drawings, wherein like or similar reference numerals designate like or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0033] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clock...

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PUM

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Abstract

The invention relates to the technical field of chemical mechanical polishing, and discloses a chemical mechanical polishing device. The chemical mechanical polishing device comprises a box body, a conveying device is installed on the right side of the bottom of the inner wall of the box body, the conveying device is composed of a conveying belt and a support, a clamping device is installed on a the upper portion in the interior of the box body and composed of a first sliding block, a clamping jaw and a first lead screw, a soaking mechanism is installed in the middle of the box body and composed of a base and a soaking box, a tool clamp is installed in the soaking box, a transmission mechanism is installed at the top of the box body, a polishing mechanism is arranged above the soaking box,and the left side of the soaking box is fixedly connected with a water tank equipped with chemical polishing liquid medicine. According to the chemical mechanical polishing device, materials needingto be polished are placed on the conveying device, then the conveying device rotates forwards to enable the materials to be conveyed to the left side of the conveying device, then the clamping jaw onthe clamping device works to clamp the materials, and a second hydraulic push rod works to enable the clamping jaw to move upwards, so that the materials ascend.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical grinding, in particular to a chemical mechanical grinding device and a chemical mechanical grinding method. Background technique [0002] Chemical mechanical polishing, in wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, lithography technology has higher and higher requirements for the flatness of wafer surface (Non-uniformity). IBM The company developed and introduced CMOS products in 1985, and successfully applied them in 64MB DRAM production in 1990. After 1995, CMP technology developed rapidly and was widely used in the semiconductor industry. Chemical mechanical polishing is also called chemical mechanical polishing. Its principle is a processing technology that combines chemical corrosion and mechanical removal. It is the only technology that can achieve global surface planarization in mechanical processing. [0003] The exi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B37/30B24B37/34B24B47/22B24B47/12B24B47/14H01L21/306
CPCB24B37/042B24B37/30B24B37/34B24B37/345B24B47/12B24B47/14B24B47/22H01L21/30625
Inventor 沈国荣
Owner 德清世锦智能科技有限公司
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