PCIE connector and electronic equipment

A technology of connectors and wiring layers, which is applied in the direction of connection, computer peripheral equipment connectors, circuits, etc., can solve the problems of insufficient utilization of board space and waste of design costs, so as to solve the waste of design costs and reduce the stacking of boards Number, the effect of reducing production costs

Inactive Publication Date: 2020-12-25
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-speed serial computer expansion bus (peripheral component interconnect express, referred to as PCIE) connector to solve the technical problem that the space between the boards cannot be fully utilized, resulting in waste of design costs

Method used

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  • PCIE connector and electronic equipment
  • PCIE connector and electronic equipment

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The present invention provides a PCIE connector, which is applied to the connection between boards, and the PCIE connector includes:

[0026] Two wiring layers, and insulating layers are formed on both sides of each wiring layer;

[0027] Each wiring layer has 2n rows of wiring, and each row of wiring includes multiple sets of wiring pairs, such as figure 1 in the trace pair 14, as figure 2 Trace pair 24 in

[0028] Multiple pairs of pins are formed on the surface of the insulating layer, and each wiring pair is connected to a pair of pins.

[0029] PCIE belongs to high-speed serial point-to-point dual-channel high-bandwidth transmission. The connected device allocates exclusive channel bandwidth and does not share bus bandwidth. It supports active power management, error reporting, end-to-end reliable transmission, hot-swapping, and quality of service functions. . 2n rows of wiring and multiple sets of wiring pairs in each row can expand the number of high-speed l...

Embodiment 2

[0041] An embodiment of the present invention provides an electronic device, which may be a server, a switch, etc., and the electronic device includes the PCIE connector provided in the foregoing embodiment.

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PUM

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Abstract

The invention provides a PCIE connector and electronic equipment, and belongs to the technical field of electronic equipment, the connector comprises two wiring layers, and insulating layers are formed on two sides of each wiring layer; each wiring layer is provided with 2n rows of wirings, and each row of wirings comprises a plurality of groups of wiring pairs; and a plurality of pairs of pins are formed on the surface of the insulating layer, and each wiring pair is connected with one pair of pins. According to the invention, the number of laminated boards can be effectively reduced, the volume of the connector is reduced, and the volume of the connector can be adjusted according to the distance between the board cards, so that the space between the board cards is fully utilized, the technical problem of waste of design cost is solved, and the production cost of the connector is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a PCIE connector and electronic equipment. Background technique [0002] With the continuous development of computer technology, cloud computing technology is applied in more and more scenarios, which requires a large number of servers to work. In the high-speed signal interconnection topology link design of the server, as the signal rate increases, the board density increases, and the application of high-density connectors in the board card interconnection design is also increasing. [0003] In practical applications, due to the fixed width and depth of the existing high-density connectors, the balance of server stacking and space cannot be considered, and the space between boards cannot be effectively used. It is often necessary to change the design of server boards to meet high-density connectors. The application of the connector causes the technical problem of w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/02H01R12/71H01R13/40
CPCH01R12/71H01R13/02H01R13/40H01R2201/06
Inventor 李永翠
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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