Embedded structure, preparation method, and substrate

Abstract

The invention discloses a method for preparing an embedded structure, which comprises the steps of: making a second circuit layer on a temporary bearing plate, covering the second circuit layer to make a first dielectric layer, image-processing the first dielectric layer to form a paste The cavity of the device is installed, so that the side of the device with the terminal is facing the opening of the cavity, and the second dielectric layer is prepared, so that the device is embedded in the second dielectric layer, and the surface of the device terminal and the surface of the second dielectric layer are A preset value, the first circuit layer is prepared on the surface of the second dielectric layer, and the first circuit layer is directly connected to the terminal of the device. The invention also discloses an embedded structure and a substrate containing the embedded structure. Through the implementation of the present invention, the process steps of the embedded structure in the prior art are simplified. The device and the circuit are connected by electroplating to ensure the stability of the connection between the device and the circuit and ensure a good electrical signal.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to an embedded structure, a preparation method and a substrate. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. Electronic products are becoming more and more miniaturized and intelligent. Correspondingly, the requirements for the core component substrates and components that constitute the interior of electronic products are getting higher and higher. Thinning and stable performance have become the key factors in the production of electronic products. [0003] How to simplify the process to achieve thinner and more stable performance of device packaging modules has become a problem to be solved by major device manufacturers. The implementation of device embedding processing in the prior art includes two parts, one part is the fabrication of a rect...

AI Technical Summary

Problems solved by technology

Device embedding completed in two parts must have disadvantages such as complicated process flow, high manufacturing cost, and thicker package body, and the soldering of the device and the circuit must be completed at the bottom of the cavity, so that the soldering effect cannot be visually inspected. Can not guarantee

[0004] In the prior art, the device and the circuit are welded by different materials. This process directly affects the stability of the electrical signal connection between the device and the circuit, thereby increasing the defect rate of the product, and the device and the circuit pass through Solder welding, the size of the gap under the device is unstable, and the filling effect is unstable when the dielectric material is laminated, there is a hidden danger of poor filling, which affects the reliability of the product

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