Infrared sensor

A technology of infrared sensors and shells, applied in the field of infrared sensors, can solve the problems of fixed installation, affect the sensitivity of detection elements, inconvenient disassembly, replacement and movement, and achieve the effect of increasing diversity, facilitating disassembly, replacement and mobile use

Inactive Publication Date: 2020-12-11
微苏科技服务江苏有限公司
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] Most of the optical detection elements of existing infrared sensors are relatively sensitive elements. When receiving and converting infrared rays for a long time, the temperature changes quickly, which affects the sensitivity of the detection elements. Secondly, most infrared sensors are packaged in the device by welding. On the circuit board, this installation method is relatively fixed and limited, and it is not convenient for disassembly, replacement and mobile use

Method used

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Examples

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Embodiment Construction

[0021] An embodiment of the present invention provides an infrared sensor, such as Figure 1-4 As shown, it includes a housing 1 and a cooling silicon wafer 10. The top of the housing 1 is connected with a protective cover 4 through a hinge. An optical anti-fog mirror is fixed inside the protective cover 4. A The filling core 6 is installed with a cooling silicon chip 10 through a card slot inside the filling core 6. The cooling silicon chip 10 includes a cold end body 13 and a hot end body 12. The cold end body 13 is wrapped inside the hot end body 12, and the hot end body The body 12 is in contact with the filling core 6 .

[0022] The specific embodiment is: the protective cover 4 is used to protect the safety and cleanliness of the objective lens in the optical element of the infrared sensor, so as to avoid unfavorable reception of infrared rays.

[0023] Such as figure 1 , figure 2 as well as Figure 4 As shown, the filling core 6 is made of polymer materials with in...

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Abstract

The invention provides an infrared sensor, which relates to the technical field of infrared sensors. The infrared sensor comprises a shell and a refrigeration silicon wafer, wherein the top of the shell is connected with a protection cover through a hinge, an optical anti-fog mirror is fixed in the protection cover, a filling core body is clamped and pressed in the shell under the protection cover, and the refrigeration silicon wafer is installed in the filling core body through a clamping groove; the interior of the refrigeration silicon wafer comprises a cold end body and a hot end body, thecold end body is wrapped in the hot end body, and the device can achieve the efficient cooling of the detector through the arrangement of the refrigeration silicon wafer, the cold end body, the hot end body and the heat dissipation fan, and avoids the reduction of the sensitivity of the detector caused by the high temperature generated by long-time work. By arranging a quick connecting pipe sleeve, a pipeline conductive clamp and an output wire, the infrared sensor can be quickly installed and used in various devices and can also be fixedly installed on a circuit board, the diversity of fixing modes of the infrared sensor is improved, and disassembly, replacement and mobile use are facilitated.

Description

technical field [0001] The invention relates to the technical field of infrared sensors, in particular to an infrared sensor. Background technique [0002] Infrared sensor is a kind of infrared sensor that can sense target radiation. It uses the physical properties of infrared to measure. Any object in the universe can produce infrared radiation as long as its temperature exceeds zero. In fact, its radiation can be refracted just like visible light. And reflection, the use of infrared light detectors has been widely valued because of its unique advantages, and has been widely used in military and civilian fields. In the military, infrared detection is used for guidance, fire control tracking, warning, and target detection , weapon thermal sights, ship navigation, etc.; in the civilian field, it is widely used in industrial equipment monitoring, safety monitoring, disaster relief, remote sensing, traffic management, and medical diagnostic technology. [0003] Most of the opt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01V8/10
CPCG01V8/10
Inventor 杨晓翔
Owner 微苏科技服务江苏有限公司
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