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Voice coil, voice coil manufacturing method and loudspeaker

A voice coil and sound cavity technology, applied in the direction of loudspeakers, sensors, electrical components, etc., can solve the problem of small thickness of the sound cavity, achieve the effect of reducing thickness, improving low-frequency performance, and controllable thickness

Active Publication Date: 2022-04-01
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sound cavity (sound cavity) of the voice coil designed in this way is smaller and thicker

Method used

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  • Voice coil, voice coil manufacturing method and loudspeaker
  • Voice coil, voice coil manufacturing method and loudspeaker
  • Voice coil, voice coil manufacturing method and loudspeaker

Examples

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Embodiment Construction

[0036] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-13 And the preferred embodiment, the specific implementation, structure, features and effects of the voice coil provided by the present invention, its manufacturing method and loudspeaker are described in detail as follows. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intervening element at the same time. When an element is re...

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Abstract

A voice coil, comprising a first base material layer, a first conductive circuit layer and a second conductive circuit layer formed on two opposite surfaces of the first base material layer, and a first adhesive layer formed on the first conductive circuit layer. an adhesive layer, a second substrate layer formed on the first adhesive layer, and a third conductive circuit layer formed on the second substrate layer; the first conductive circuit layer includes at least a first conductive circuit, a second conductive circuit The layer includes at least one second conductive circuit, the third conductive circuit layer has at least one third conductive circuit, the first conductive circuit and the second conductive circuit are respectively coiled on the first substrate layer in a coil shape, and the third conductive circuit is coiled. Coiled on the second base material layer; the first conductive line, the second conductive line and the third conductive line are electrically connected end to end along the current flow direction; the first conductive line, the second conductive line and the third conductive line constitute the sound of the voice coil cavity. The invention also relates to a manufacturing method of a voice coil and a loudspeaker.

Description

technical field [0001] The invention relates to a multilayer printed circuit board technology, in particular to a voice coil, a manufacturing method of the voice coil and a loudspeaker. Background technique [0002] The loudspeaker is a commonly used electroacoustic transducer device, which is often used in electronic components that produce sound. Loudspeakers generally include a magnetic circuit system (permanent magnet, stem, magnetic plate), vibration system (paper cone (diaphragm), voice coil) and support auxiliary system (centering support, basin frame (diaphragm frame), pad side) and other three parts. Among them, the voice coil is the driving unit of the speaker. It is made of very thin copper wires wound on the paper tube in two layers, generally dozens of turns, also known as the coil, placed in the magnetic core column and the magnetic plate. In doubt. The voice coil and the paper cone are fixed together. When the sound current signal is passed into the voice c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R31/00H04R9/02H04R9/06
CPCH04R31/003H04R9/06H04R9/02H04R2231/001H04R2400/11
Inventor 沈芾云徐筱婷何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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