Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Nano-capacitor three-dimensional integrated structure and preparation method thereof

A technology of nanocapacitors and three-dimensional integration, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of large series resistance of nanocapacitors, affecting the power density of nanocapacitors, reducing power density, etc.

Active Publication Date: 2020-12-01
FUDAN UNIV +1
View PDF6 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high resistivity of the silicon material, the series resistance of the nanocapacitor is large, which will reduce the power density
Although the atomic layer deposition process can deposit a thin film with good conformality and uniformity in a high aspect ratio structure, due to the large amount of impurities in the deposited metal material, the resistivity of the metal electrode is high, which affects the power density of the nanocapacitor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Nano-capacitor three-dimensional integrated structure and preparation method thereof
  • Nano-capacitor three-dimensional integrated structure and preparation method thereof
  • Nano-capacitor three-dimensional integrated structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. It should be understood that the specific The examples are only used to explain the present invention, not to limit the present invention. The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "vertical" and "horizontal" are based on the orientation or positional relation...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Widthaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a nano-capacitor three-dimensional integrated structure and a preparation method thereof. The nano-capacitor three-dimensional integrated structure comprises a first nano-capacitor structure and a second nano-capacitor structure which are vertically stacked and formed in a groove of a silicon substrate, and the first nano-capacitor structure and the second nano-capacitor structure are connected in parallel. The high aspect ratio silicon nanostructure etched at one time is changed into the high aspect ratio silicon nanostructure etched at two times, so that the requirement on the precision of etching equipment can be reduced, and the manufacturing cost can be reduced. Due to the fact that the aspect ratio of a single silicon nanostructure is reduced, the step coverage rate of the thin film can be increased, the conformality of the thin film can also be enhanced, and therefore holes of the thin film in the deposition process can be reduced. And traditional sputtering equipment can be adopted to deposit a metal material, so that a metal electrode with relatively low resistivity can be obtained. Moreover, the overall capacitance density of the nano capacitor canbe improved, and the planar area occupied by the capacitor is reduced, so that a small-size energy buffer device can be obtained.

Description

technical field [0001] The invention belongs to the field of integrated circuit manufacturing, and in particular relates to a three-dimensional integrated structure of nanocapacitors and a preparation method thereof. Background technique [0002] Currently, batteries are still the main energy supply components for portable electronic devices. Although battery technology is constantly evolving, there is still a trade-off between battery capacity and volume and weight. Accordingly, some alternative power supply components with large capacity, light weight, and small size have been researched and developed, such as micro fuel cells, plastic solar cells, and energy harvesting systems. In all the cases mentioned above, an energy buffer system is usually required to maintain a continuous and steady energy output. For example, fuel cell systems are generally believed to have slower start-up times and lower kinetic energy. Therefore, a hybrid system in which the fuel cell provide...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/522H01L23/528H01L21/768
CPCH01L23/5223H01L23/528H01L21/768
Inventor 朱宝陈琳孙清清张卫
Owner FUDAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products