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Memory, forming method thereof and semiconductor device

A memory and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of easy crosstalk between word lines, crosstalk of conductive parts, interference, etc., and achieve the effect of avoiding deformation or even collapse

Active Publication Date: 2020-11-27
FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD
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  • Summary
  • Abstract
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Problems solved by technology

However, as mentioned above, with the continuous reduction of the distance, it is more likely to cause the problem of crosstalk between adjacent conductive components
For example, it is easy to crosstalk between adjacent word lines; and it is also easy to generate interference between the word line and the active area of ​​adjacent and isolated unit devices, which will cause problems such as electrical drift of the word line

Method used

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  • Memory, forming method thereof and semiconductor device
  • Memory, forming method thereof and semiconductor device
  • Memory, forming method thereof and semiconductor device

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Embodiment Construction

[0068] The memory and its forming method proposed by the present invention will be further described in detail below with reference to the drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0069] Figure 1a It is a memory in an embodiment of the present invention, which mainly shows the distribution diagram of the active region and the isolation region of the device, Figure 1b It also shows a top view of the word line for the memory in an embodiment of the present invention, figure 2 for Figure 1b Schematic cross-sectional view of the memory shown in II' and II II' directions. combine Figure 1a ~ Figure 1b and figure 2 As shown, the memory includes a substrate 10...

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Abstract

The invention provides a memory, a forming method thereof and a semiconductor device. A first isolation structure and a second isolation structure which are made of different insulating materials areused for defining the active regions of the unit devices, so that the formation of isolation regions with different dielectric constants is facilitated, the isolation performance of the word lines passing through the isolation regions can be improved by utilizing the isolation structures in the isolation regions, and the problem of electrical drifting of the word lines is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a memory and a forming method thereof. Background technique [0002] As the semiconductor industry enters a new era of high-performance and multi-functional integrated circuits, the density of semiconductor elements in integrated circuits will increase accordingly, and the spacing between semiconductor elements will decrease accordingly. At this time, for the conductive components used to realize electrical transmission in the semiconductor element, as the distance between adjacent conductive components decreases, the interference phenomenon between adjacent conductive components becomes more and more serious. obvious. [0003] Among them, there is also a trend of shrinking size in the field of memory, so that the arrangement among various components in the memory is also more compact. However, as mentioned above, with the continuous reduction of the distance, it is more...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/088H01L27/12H01L21/77
CPCH01L27/0886
Inventor 童宇诚詹益旺刘安淇李甫哲林刚毅
Owner FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD
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