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Epoxy resin composition and preparation method thereof

A technology of epoxy resin and composition, which is applied in the field of epoxy resin composition and its preparation, and can solve the problems of poor storage stability, insufficient filling, low resin viscosity, etc.

Pending Publication Date: 2020-11-24
JIANGSU HHCK NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the epoxy resin composition with high filler content, because it is a single component and has a high filler content, the viscosity of the resin used is relatively low, and the storage stability is relatively poor. When it is used near the shelf life, it is prone to index decay. Seriously lead to filling dissatisfaction
At present, there is no clear solution to this problem in the market. The main reason is to use the "first in, first out" method to prevent the use of materials that are close to the shelf life.

Method used

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  • Epoxy resin composition and preparation method thereof
  • Epoxy resin composition and preparation method thereof
  • Epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment 1, a kind of epoxy resin composition, this composition comprises epoxy resin, filler, curing agent, curing agent accelerator, coupling agent, release agent, coloring agent, does not add surface additive and stress absorber,

[0038] The added amount of the epoxy resin accounts for 6.3% of the total weight of the epoxy resin composition, and the epoxy resin is selected from the phenol arane type epoxy resin NC-3000L of the biphenylene skeleton structure;

[0039] The added amount of the filler accounts for 88% of the total weight of the epoxy resin composition, and the filler is selected from spherical silica with an average particle diameter of 20 microns or 10 microns;

[0040] The addition amount of curing agent accounts for 4.2% of epoxy resin composition gross weight, and curing agent selects phenolic resin for use, and the ratio of the epoxy equivalent of epoxy resin and the hydroxyl equivalent of phenolic resin is 1.0;

[0041] The consumption of curing...

Embodiment 2

[0046] Embodiment 2, a kind of epoxy resin composition, the epoxy resin in this composition selects biphenyl type epoxy resin YX-4000H for use, all the other are the same as that of embodiment 1, and the preparation method is also the same as that of embodiment 1.

Embodiment 3

[0047] Embodiment 3, a kind of epoxy resin composition, the epoxy resin in this composition selects the mixture of the phenol aralkyl type epoxy resin NC-3000 of biphenylene skeleton structure and biphenyl type epoxy resin YX-4000H , wherein, the phenol aralkylene type epoxy resin of the biphenylene skeleton structure accounts for 40% of the total weight of the epoxy resin, and the biphenyl type epoxy resin YX-4000H accounts for 60% of the total weight of the epoxy resin;

[0048] The curing agent is selected from the mixture of phenolic resin MEH-7800SS with phenol aralkyl skeleton and phenol aralkyl type phenolic resin MEH-7851SS containing biphenylene skeleton structure, wherein MEH-7800SS accounts for 30% of the total weight of the curing agent, MEH-7851SS accounts for 70% of the total weight of the curing agent;

[0049] All the other are the same as in Example 1, and the preparation method is also the same as in Example 1.

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Abstract

The invention provides an epoxy resin composition and a preparation method thereof. The composition contains epoxy resin, filler, a surface treating agent, a stress absorbent and a curing agent, wherein the surface treating agent contains phenylphosphonic acid represented in the formula (1), phenylphosphonic acid accounts for 30% or more of total content of the surface treating agent, the adding quantity of the surface treating agent is 0.01-0.07 mg / m<2> through calculation based on specific surface area of the filler, and the stress absorbent is rubber modified active polyamide resin represented as the formula (2). With adoption of phenylphosphonic acid as the surface treating agent, the originally hydrophilic filler surface is changed into a partly hydrophilic and partly hydrophobic filler surface, so that overall water absorption of an epoxy molding compound can be reduced, strength between the filler and the resin is also enhanced, and long-storage stability of the epoxy resin composition is improved; and with adoption of the stress absorbent, internal stress of the epoxy resin composition is reduced, heat resistance of the epoxy resin composition is improved, and failure phenomena of layering and the like of the epoxy resin composition are avoided.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition and a preparation method thereof. Background technique [0002] With the continuous development of the semiconductor market, electronic and electrical equipment is also developing towards miniaturization, light weight and high performance, and the packaging form has also developed from the original pin insertion type to surface mount type as the mainstream. For the mainstream Small Outline Package (SOP), Plastic Quad Flat Package (Plastic Quad Flat Package), and the emerging Quad Flat No-lead Package (QFN), solder ball array package ( Ball Grid Array, BGA), grid array package (Land Grid Array, LGA) fan-out wafer level package (Fan-Out Wafer Level package, FOWLP) and other high-end packaging forms such as reliability and warpage requirements, developed The filler content of the epoxy resin composition is also constantly rising, from the original 60-80%, to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L77/10C08K13/06C08K9/04C08K7/18
CPCC08L63/00C08L2201/08C08L2205/05C08L2205/03C08L2205/025C08L2205/035C08K2201/014C08L2207/53C08L77/10C08K13/06C08K9/04C08K7/18
Inventor 刘红杰谭伟成兴明李兰侠段杨杨范丹丹崔亮蒋小娟韩江龙李文翔
Owner JIANGSU HHCK NEW MATERIAL CO LTD
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