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A packaging process for LED chips

A technology of LED chips and packaging technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of uneven light output, weak light efficiency, and the settlement of phosphors to the bottom of the four sides, so as to achieve stable anti-settling and improve light output efficiency. Effect

Active Publication Date: 2022-04-22
广东安珂光电科技有限公司
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The packaged LED chip has single-side (top) light-emitting and multi-side light-emitting types. For multi-side light-emitting LED chips, it is necessary to coat the four sides and the top surface with fluorescent glue, but coat five light-emitting surfaces at the same time. During the flat curing process, it is easy for the phosphor to settle to the bottom of the four sides, resulting in uneven light output, weak light effect, and yellow edges at the bottom, which seriously affect product quality

Method used

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  • A packaging process for LED chips
  • A packaging process for LED chips
  • A packaging process for LED chips

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Embodiment Construction

[0023] The scheme of this application is further described in conjunction with the accompanying drawings as follows:

[0024] A packaging process for LED chips, comprising the following steps:

[0025] S1, see figure 1 As shown in figure (a), a carrier 1 and a matrix array of LED chips 2 arranged on the carrier 1 are provided, and there are gaps 3 between adjacent LED chips 2 .

[0026] S2, see figure 1 As shown in the figure (b), the gap 3 is filled with the anti-sedimentation fluorescent glue 4, and the thickness of the anti-settling fluorescent glue 4 is controlled to be flush with the top surface of the LED chip 2, and the anti-settling fluorescent glue 4 is dried and cured. Glue 4. Specifically, do the following:

[0027] S2.1. Coating the anti-sedimentation fluorescent glue 4 on the matrix array of LED chips 2, the anti-sedimentation fluorescent glue 4 consists of 85-115 parts by weight of AB glue, 76-83 parts by weight of phosphor powder, 0.3- It is prepared by mix...

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Abstract

The present invention proposes a LED chip packaging process, which includes the following steps: S1, providing a carrier, and a matrix array of LED chips arranged on the carrier, with gaps between adjacent LED chips; S2, using The anti-sedimentation fluorescent glue fills the gap, the anti-settling fluorescent glue is controlled at a thickness that is flush with the top surface of the LED chip, and the anti-settling fluorescent glue is dried and cured; S3, coating the matrix array of the LED chips Cover the quick-drying fluorescent glue to cover the top surface of the LED chip, dry and cure the quick-drying fluorescent glue; S4, compound the AB glue protective film on the cured quick-drying fluorescent glue; S5, cut the A matrix array of LED chips is obtained to obtain an LED chip package. The LED chip package prepared by the LED chip package process of the present invention can improve the situation of fluorescent powder sedimentation in the fluorescent adhesive layer of the LED chip.

Description

technical field [0001] The invention relates to a packaging process for LED chips. Background technique [0002] In the manufacturing process of LED lights, LED chips need to be packaged. The packaged LED chip has single-side (top) light-emitting and multi-side light-emitting types. For multi-side light-emitting LED chips, it is necessary to coat the four sides and the top surface with fluorescent glue, but coat five light-emitting surfaces at the same time. In the flat curing process, it is easy for the phosphor to settle to the bottom of the four sides, resulting in uneven light emission, weak light effect, and yellow edges at the bottom, which seriously affect the product quality. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the present invention proposes a packaging process for LED chips, which can improve the phenomenon of fluorescent powder sedimentation in the fluorescent adhesive layer of the LED chips. [0004] The p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/54H01L33/50H01L25/075H01L33/56
CPCH01L25/0753H01L33/505H01L33/54H01L33/56H01L2933/005
Inventor 麦家通戴轲
Owner 广东安珂光电科技有限公司
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