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An igct package structure

A technology of packaging structure and frame structure, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of long circuitous length of commutation circuit, complicated packaging process, uneven pressure transmission, etc., and achieve improvement Effects of packaging efficiency, reduction of stray inductance, and reduction of detour length

Active Publication Date: 2022-04-29
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Abstract
  • Description
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Problems solved by technology

Therefore, there are problems of uneven pressure transmission and complicated packaging process. At the same time, there is also the problem of long detour length of the commutation circuit, which leads to more stray inductance.

Method used

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  • An igct package structure
  • An igct package structure

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Embodiment Construction

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the protection scope of the present invention is not limited thereby.

[0032] figure 1 The cross-sectional structure of the IGCT package structure 10 according to the embodiment of the present invention is schematically shown. figure 2 Schematically shows figure 1 The local enlarged structure.

[0033] Such as figure 1 with figure 2 As shown, the IGCT package structure 10 of the embodiment of the present invention includes a ring-shaped gate 1 , a connection part 2 , an elastic support part 3 and a gate-connecting ring 4 . Wherein, the top and the bottom of the connection part 2 are respectively connected with the annular gate 1 and the gate circumscribed ring 4 , and the elastic supporting part 3 is located in the connection part 2 . According to the IGCT packaging structure of the present invention, the connection part and...

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Abstract

The invention provides an IGCT packaging structure, which includes a ring-shaped gate, a connecting part, an elastic supporting part and an external connection ring of the gate. Wherein, the top and the bottom of the connection part are respectively connected with the ring-shaped gate electrode and the outer ring of the gate electrode, and the elastic supporting part is located in the connection part. The IGCT packaging structure provided by the present invention can simplify the packaging process while ensuring uniform pressure transmission, improve packaging efficiency, and effectively shorten the detour length of the commutation circuit, thereby effectively reducing the IGCT packaging structure of the stray inductance of the commutation circuit.

Description

technical field [0001] The invention relates to the technical field of IGCT packaging, in particular to an IGCT packaging structure. Background technique [0002] In the IGCT (Integrated Cate-Commutated Thyristor) package structure in the prior art, the disc spring is located close to the center of the IGCT package structure. During the packaging process, one end of the gate external ring needs to be bent upward to complete the installation of the disc spring. The disc spring After the installation is completed, the gate outer ring needs to be reset to ensure contact with the ring gate. Therefore, there are problems of uneven pressure transmission and complicated packaging process, and at the same time, there is also the problem of long detour length of the commutation circuit, resulting in more stray inductance. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art, provide a method...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L29/74
CPCH01L23/3121H01L29/74
Inventor 孙永伟陈芳林曾文彬潘学军陈勇民董超邹平
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD
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