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A kind of anti-sulfurization, high thermal conductivity, high temperature resistant conductive gold glue

A technology with high thermal conductivity and high temperature resistance, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc.

Active Publication Date: 2021-12-17
德邦(昆山)材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the problems encountered in the prior art, and provide a kind of anti-vulcanization, high thermal conductivity, high temperature resistant conductive gold glue for LED packaging

Method used

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  • A kind of anti-sulfurization, high thermal conductivity, high temperature resistant conductive gold glue
  • A kind of anti-sulfurization, high thermal conductivity, high temperature resistant conductive gold glue
  • A kind of anti-sulfurization, high thermal conductivity, high temperature resistant conductive gold glue

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Experimental program
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Effect test

preparation example Construction

[0034] Preparation of polyurethane acrylic epoxy resin:

[0035] (1) Throw 60g IPDI and 0.2g antioxidant B225 into the four-necked flask, start stirring, heat up to 50 degrees, add 0.02g catalyst T-12, start to drop 115.6 bisphenol F epoxy acrylic resin, drop for 0.5 hours After adding, keep warm for 2.5 hours, and control the temperature between 55-65 degrees;

[0036] (2) Sampling and testing NCO, it dropped to 4.48%;

[0037] (3) Then raise the temperature to 75-85 degrees, add 0.2g of polymerization inhibitor MEHQ, 0.02g of catalyst T-12, add dropwise HEA, 0.5 hours to complete the dropwise addition, keep warm for 2.5 hours, and control the temperature between 80-90 degrees;

[0038] (4) Take a sample to measure NCO, and if it falls below 0.1%, wash the resin three times with acetone and dry it in vacuum.

[0039] Preparation of modified flake gold powder:

[0040] (1) Chlorauric acid HAuCl 4 4H 2 O was dissolved in distilled water to prepare a 20% gold solution, and ...

Embodiment 1

[0046] 3 parts of polyurethane modified epoxy acrylate, 8 parts of epoxy resin 830LVP, 8 parts of epoxy acrylic thinner GMA, 0.5 parts of BMI, 3 parts of DDS, 0.2 parts of Trigonox 42S, 80 parts of modified flake gold powder, KH -570 Add 0.3 parts of coupling agent into the mixing tank, stir to control the temperature at 20-40°C, stir at a speed of 300r / min, stir for 2h, and finally vacuumize for 0.5h, and discharge for testing.

Embodiment 2

[0048] Sequentially add 5 parts of polyurethane modified epoxy acrylate, 6 parts of epoxy resin 830LVP, 8 parts of epoxy acrylic thinner GMA, 0.5 part of PMI, 3 parts of DDS, 0.2 part of Trigonox 42S, 80 parts of modified flake gold powder, KH -570 Add 0.3 parts of coupling agent into the mixing tank, stir to control the temperature at 20-40°C, stir at a speed of 300r / min, stir for 2h, and finally vacuumize for 0.5h, and discharge for testing.

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Abstract

An anti-vulcanization, high thermal conductivity, high temperature resistant conductive gold adhesive, comprising the following components in parts by weight: 0.5 to 5 parts of polyurethane modified epoxy acrylate, 5 to 10 parts of epoxy resin, and 2 parts of epoxy acrylic thinner ~10 parts, 0.5~5 parts of high temperature resistant resin, 0.1~5 parts of epoxy curing agent, 0.05~1 part of acrylic curing agent, 75~90 parts of modified flake gold powder, 0.1~5 parts of binder; The polyurethane acrylic epoxy resin used has high flexibility and heat resistance, and the introduction of Shuangma resin also improves the heat resistance of the conductive adhesive; the dual curing of acrylic and epoxy systems has both the heat resistance of epoxy and the It has the adhesiveness of acrylic acid and the combination with baseless filler; the gold powder has vulcanization resistance, so the conductive adhesive of the present invention can well meet the requirements for high stability of LEDs in special fields.

Description

technical field [0001] The invention relates to an anti-sulfurization, high thermal conductivity and high temperature resistant conductive adhesive, which belongs to the technical field of adhesives. Background technique [0002] The rise of the LED industry has brought new hope to energy conservation, emission reduction, and energy environmental protection, showing an extremely broad application prospect. With the rapid development of the LED industry, especially the lighting industry, LED is gradually developing towards high power, so more and more comprehensive requirements are put forward for packaging materials. [0003] With the development of industry, the sulfur content in the air is increasing day by day, and the corrosion of various volatile sulfides and halides in the air makes the surface dark and discolored. Studies have shown that discoloration increases the surface resistance by about 20-80%, and increases power loss, which greatly reduces the stability and r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J175/16C09J163/00C09J179/08C09J11/04C08G18/67
CPCC09J9/02C09J175/16C09J11/04C08G18/6705C08G18/672C08L2203/206C08L2201/08C08L2205/03C08K2201/001C08L63/00C08L79/085C08K9/04C08K7/00
Inventor 王守立陈田安王建斌解海华
Owner 德邦(昆山)材料有限公司
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