Guide apparatus for substrate transfer

A technology of guiding devices and substrates, applied in the direction of packaging, conveyors, conveyor objects, etc., can solve problems such as damage, swing or bending, and poor G of the substrate

Pending Publication Date: 2020-10-27
DMS CO LTD
View PDF16 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the substrate G conveyed along such a substrate conveying device sometimes undergoes swinging or bending phenomena due to changes in load or pressure applied to the surface of the substrate G during th...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Guide apparatus for substrate transfer
  • Guide apparatus for substrate transfer
  • Guide apparatus for substrate transfer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] Hereinafter, description will be made with reference to the accompanying drawings of preferred embodiments of the present invention that can concretely realize the problems to be solved above. In describing the present embodiment, the same names and the same reference numerals are used for the same configurations, and additional description thereof will be omitted.

[0032] figure 2 is a perspective view of a substrate transfer guide device according to a first embodiment of the present invention, image 3 yes figure 2 An exploded perspective view of the substrate transfer guide shown.

[0033] The substrate conveying guide device according to the present invention may be provided as a pair disposed opposite to each other at both end portions of the substrate G.

[0034] In addition, a plurality of the pair of substrate transfer guide devices may be arranged at intervals along the longitudinal direction of the substrate G to be transferred.

[0035] refer to fig...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a guide apparatus for substrate transfer which can prevent the substrate from swinging or bending in the transfer and processing process of the substrate so as to prevent the substrate from being damaged by impact and stably convey the substrate. To this end, the present invention discloses the following features: a side support roller for guiding the conveyance of a substrate while rotating in contact with the side surface of the substrate; a lower support roller that is disposed at a distance from the side support roller in the width direction of the substrate and supports the substrate while rotating in contact with the lower surface of the substrate; a base member that rotatably supports the side surface support roller and is provided so as to be capable of adjusting a gap between the side surface of the substrate and the side surface support roller; and a lower support member that rotatably supports the lower support roller, connects the base member and thelower support roller, and is provided so as to be capable of adjusting the position of the lower support roller.

Description

technical field [0001] The present invention relates to a substrate conveying and guiding device, and more specifically, to a substrate conveying and guiding device capable of preventing warping or damage of a side surface of a substrate during substrate conveying and processing. Background technique [0002] In general, substrates used in displays, semiconductor wafers, LCDs, and glass for photomasks are subjected to various processing steps. For example, the processing steps may include unit steps such as etching, stripping, rinsing, drying, and the like. [0003] In the process, the processing efficiency is improved by continuously performing the processing process on the substrate while transferring the substrate. [0004] Therefore, in order to improve the yield of substrates to be processed, a technique for stably maintaining the posture of the substrate being conveyed is required. [0005] refer to figure 1 A conventional substrate transfer device includes a substr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/677
CPCH01L21/67742B65G49/061B65G39/18B65G13/00G02F1/1303H01L21/67706B65G2201/022B65G2207/08
Inventor 朴庸硕朴桓绪李贤情
Owner DMS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap