A wafer automatic brushing machine

Abstract

The invention belongs to the technical field of wafer production and processing. It provides an automatic wafer brushing machine, which includes a frame. The frame is provided with a workbench. The workbench is provided with a material rack. The material rack is provided with several flower basket placement positions. , there is a wafer positioning mechanism in the middle of the material rack; a mechanical arm is also installed on the workbench, and a wafer support plate is installed on the execution end of the mechanical arm; there are brush boxes on both sides of the robot arm, and one side of the brush box There is a wafer pick-and-place port; a vacuum tube driven by a first driving device and a second driving device is provided under the workbench, a Bernoulli suction cup is installed on the top of the vacuum tube, and a third driving device and a fourth driving device are provided on the workbench. There is an upper mounting plate, and one end of the upper mounting plate located in the brush box is rotatably installed with a sponge brush head driven by a fifth driving device. The invention realizes automatic brushing of the wafer, greatly improves the brushing efficiency, makes the brushing cleaner and more thorough without causing secondary pollution and scratches to the wafer, and ensures that the quality and qualification rate of the wafer are not affected.

Description

technical field [0001] The invention relates to the technical field of wafer production and processing, in particular to an automatic wafer brushing machine. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. With the continuous shrinking of the critical dimensions of semiconductor devices and the introduction of new materials, during the production and processing of wafers, the requirements for the cleanliness of the wafer surface are becoming more and more stringent, and multiple cleanings are usually required to remove Attached dirt and process fluid. [0003] At present, the cleaning of wafers is usually divided into two methods: tank cleaning and single-chip cleaning; tank cleaning is to put the wafer in the cleaning tank for cleaning, which can realize the cleaning of several wafers at the same time, with high cleaning efficiency , but the cleanin...

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic wafer brushing machine to solve the problem of manual single-chip scrubbing of wafers at present, which has low scrubbing efficiency, high labor intensity, and is easy to scratch the wafer, which affects Wafer Quality Technical Issues

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