Cu powder applied to laser cladding of P-Cu work piece, and cladding method

Abstract

The invention belongs to the technical field of laser cladding and particularly relates to Cu powder applied to laser cladding of a P-Cu work piece, and a cladding method. The Cu powder comprises thefollowing components: 2.5-9% of Sn, 0.05-0.6% of P, 0.01-0.05% of Pb, 0-0.5% of Ce, 0-1% of Y, 0-0.2% of Sm and the balance being Cu and inevitable sundries. The method comprises the following steps:carrying out pre-processing on the surface of the work piece; carrying out tinning on the surface of the work piece; manufacturing a work piece cooling supporting base for a cladding process; preparing the Cu powder applied to laser cladding of the P-Cu work piece and drying the Cu powder; fixing the work piece above the cooling supporting base, carrying out cooling in the cladding process, irradiating a cladding position on the surface of the work piece by a laser, feeding the Cu powder to the cladding position on the surface of the work piece by a synchronous powder feeding machine, and carrying out laser cladding on the surface of the work piece; carrying out abrasive blasting on the surface of the cladding position; and carrying out processing and shaping of the work piece. According to the invention, metallurgical bonding of a cladding layer and a work piece base material is presented, and the organizational structure is compact without gas holes or cracks. Results of hardness, wear resistance and corrosion prevention experiments show that transition between the cladding layer and the work piece base material is natural, performance is simple, and curves are steady.

Description

technical field [0001] The invention belongs to the technical field of laser cladding, and in particular relates to a copper powder for laser cladding of a phosphor copper workpiece and a cladding method. Background technique [0002] Among the existing phosphor copper surfacing repair technologies, only laser cladding technology can achieve metallurgical bonding effect and batch processing under the premise of extremely small heat input. However, in the actual production process, due to the high reflectivity and material characteristics of copper alloy materials for common semiconductor lasers, the cladding has the following problems: [0003] 1) Before cladding, the adhesive or light absorbing agent applied to increase the light absorption rate of the substrate enters the molten pool, causing adverse effects; [0004] 2) Before cladding, the surface is pretreated with nickel-based materials, which changes the comprehensive performance of the bonding area and the additive ...

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Problems solved by technology

[0005] 3) At the beginning of cladding, in order to reduce the excessive demand for laser energy density, the use of aluminum-based admixtures changes the overall performance of the cladding layer and makes it difficult to control the cladding bead effect;

[0006] 4) During cladding molding, the weld bead is easy to crack due to excessive cooling;

[0007] 5) When cladding is lapped, due to multiple laps, excessive heat accumulation is caused, and the thin-walled substrate is easily deformed;

[0008] 6) After the cladding is completed, the material difference between the cladding layer and the base material is too large, which will cause excessive gradient results in the hardness, wear resistance, corrosion resistance, electrical conductivity, heat conduction and mechanical comprehensive properties of the final workpiece

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