Design method and system for reducing link loss of circuit board, and circuit board
A link loss and design method technology, applied in printed circuit components, computer-aided design, programmable/customizable/modified circuits, etc., can solve the problem of increased circuit board cost, occupied circuit board space, and increased circuit board cost High-level problems, to prevent circuit board delamination problems, reduce link loss, and avoid cost increases
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[0048] The core of the present invention is to provide a design method, system and circuit board for reducing the link loss of the circuit board. The link loss is reduced by reducing the roughness of the link copper foil, and the cost increase caused by upgrading the circuit board is avoided. problem and the problem of insufficient wiring space caused by additional driver chips; moreover, this application only reduces the copper foil roughness of high-speed signal links with high link loss requirements, and the copper foil roughness of non-high-speed signal links remains high. Roughness, in order to ensure the degree of bonding between the copper foil and the interlayer medium of the circuit board on the basis of meeting the circuit board link loss requirements, so as to prevent the problem of circuit board delamination caused by insufficient bonding.
[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, t...
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