Tensile-induced crystallization viscosity-reducing composition, preparation method and application thereof

A technology of inducing crystallization and composition, applied in the direction of conductive adhesives, adhesive types, ester copolymer adhesives, etc., can solve the problems of complex preparation process and many process procedures, and achieve the effect of improving viscosity

Active Publication Date: 2021-12-24
SUZHOU SHIHUA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, electronic components are mainly composed of multi-layer structures. The preparation process is complicated and there are many process procedures. Many pressure-sensitive tapes are used in the assembly process of electronic devices. Once problems occur during the construction process, users are considering cost reduction. , you will first want to be able to separate the problematic components from the good ones
However, this contradicts the initial choice of pressure-sensitive adhesive to bond the two parts securely

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] In a glass reactor equipped with mechanical stirring, reflux condenser, thermometer, and heating jacket, 92 parts of methyl acrylate, 8 parts of ethylene glycol diacrylate, and 30 parts of toluene were added to the reactor, and mechanically stirred to make it After mixing and forming a uniform and transparent solution, heat the temperature of the reaction bottle to 50-60°C, dissolve azobisisobutyronitrile (10 parts) with toluene (2 parts), drop them into the reaction kettle, and continue to heat up to Stir the reaction at 70-80°C for 3-4 h. After the temperature of the reaction system drops to room temperature (25-30°C), the above prepolymer is filtered out to obtain a prepolymer with a viscosity of 1000cP (solid content: 40%).

[0027] Add 95 parts of the prepolymer obtained above, 5 parts of polydecanediamide, add 30 parts of toluene to dissolve and mix evenly, and finally add 15 parts of toluene diisocyanate into the reaction kettle dropwise, and repeatedly stir the ...

Embodiment 2

[0029] 95 parts of the prepolymer obtained in Example 1, 5 parts of polydecanediamide, were dissolved in 30 parts of toluene and mixed uniformly, then slowly added 20 parts of silver powder to the above system, stirred and mixed for 30 minutes, Finally, 15 parts of toluene diisocyanate was added dropwise into the reactor, and the mixture was repeatedly stirred until uniform. The mixture is vacuum decompressed to defoam, and the thickness of 20-150 μm is controlled by a scraper, and it is evenly coated on the release film, so as to obtain the long-chain polyamide-induced crystallization under stretching conditions described in the present invention. Conductive tapes that loosen the stickiness and come off the substrate.

Embodiment 3

[0031] Except that 15 parts of polydodecadiamide dodecane was used instead of 5 parts of polydodecadiamide decanediamide, the remaining conductive tape was prepared in the same manner as in Example 2.

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Abstract

The invention relates to a stretch-induced crystallization viscosity-reducing composition, a preparation method and application thereof. The stretch-induced crystallization viscosity-reducing composition comprises an acrylic acid prepolymer providing adhesive properties and a long carbon chain with stretch-induced crystallization properties polyamide. The stretch-induced crystallization viscosity-reducing composition of the present invention has excellent adhesive strength under normal use conditions when applied to stretch-bonding adhesive tapes, and can induce crystallization under stretching conditions to sharply reduce the viscosity of the tape and achieve removable Purpose.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a stretch-induced crystallization viscosity-reducing composition, a preparation method and an application thereof. Under stretching conditions, the adhesive tape to which the composition is applied can be sharply reduced in viscosity to achieve the purpose of removal . Background technique [0002] Due to its unique viscoelastic properties, pressure-sensitive adhesives have developed rapidly in the field of consumer electronics. At present, electronic components are mainly composed of multi-layer structures. The preparation process is complicated and there are many process procedures. Many pressure-sensitive tapes are used in the assembly process of electronic devices. Once problems occur during the construction process, users are considering cost reduction. , you will first want to be able to separate the problematic component from the good one. However, this contradicts the initial c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J177/06C09J177/02C09J133/12C09J9/02C09J7/30C09J7/10
CPCC09J177/06C09J177/02C09J9/02C09J7/30C09J7/10C08K2003/0806C08K2003/2227C08K2003/385C09J2477/00C09J2433/00C08L33/12C08K3/08C08K3/22C08K3/38
Inventor 顾正青窦军彦周奎任陈启峰
Owner SUZHOU SHIHUA NEW MATERIAL TECH
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