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A planar target unbinding device and method

A planar target and unbundling technology, which is applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of multi-indium solder and difficult separation

Active Publication Date: 2022-05-17
FUJIAN ACETRON NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the device is used for unbinding, there will be more indium solder remaining on the residual target and the back plate, and the copper wire and indium solder during the unbinding process will be mixed together and fall into the indium basket, making it difficult to separate

Method used

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  • A planar target unbinding device and method
  • A planar target unbinding device and method

Examples

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Embodiment 1

[0066] Unbinding the planar target by using the planar target unbinding device provided by the present invention includes the following steps:

[0067] (a) Planar target washing: wipe off the dust on the surface of the planar target with a clean cloth, then put the planar target into an ultrasonic cleaning machine, ultrasonically wash it with deionized water for 25 minutes, take it out and dry it for use; wherein, the The planar target material includes a waste target, an indium solder layer and a copper back plate that are stacked in sequence, and several copper wires are arranged in the indium solder layer;

[0068] (b) Removing the backsplash film: use a sandblasting gun to perform sandblasting on the position of the backsplash film in the cleaned planar target to remove the backsplash film and obtain a pretreated target:

[0069] (c) Infrared heating melting indium: put the pretreatment target on the conveying device 1, and the copper back plate is in contact with the upper ...

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Abstract

The invention provides a planar target unbinding device and method, belonging to the technical field of target unbinding. The planar target unbinding device provided by the present invention can realize the unbinding of the planar target, wherein the delivery of the planar target in each area can be realized by using the transmission device, and the infrared heating of the planar target can be carried out by using the infrared heating device. Realize the melting of indium solder in the planar target. The components in the indium removal device are properly set up, which can effectively scrape off the indium solder attached to the back plate and the waste target (the back plate can be directly put into secondary use), and the recovery rate of indium solder is high ( The recovery rate can reach more than 97%). At the same time, the automatic separation of indium solder and copper wire can be realized, which avoids the step of secondary separation of indium solder and copper wire, and improves the processing efficiency. In addition, the planar target unbinding device provided by the present invention can realize automatic and large-scale unbinding of planar targets, save a lot of manpower, and greatly improve the efficiency of unbinding.

Description

technical field [0001] The invention relates to the technical field of target unbinding, in particular to a planar target unbinding device and method. Background technique [0002] In recent years, due to the rapid development of the electronic display industry, the demand for magnetron sputtering targets is also increasing. The magnetron sputtering target consists of two parts, the target and the back plate, and the bonding process of the target and the back plate is usually called target binding. The general process of target binding is as follows: first metallize the surface of the target and the back plate, and then evenly lay several copper wires with a diameter of 0.2 to 1 mm on the back plate to ensure that the thickness of the indium solder layer is uniform during brazing. Finally the solder bond is done with indium solder. [0003] Generally, the utilization rate of planar targets is low, generally only about 30-40%, and the cost of the backplane is relatively exp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C22B7/00C22B58/00
CPCC23C14/35C23C14/3407C22B7/005C22B58/00Y02P10/20
Inventor 黄先彬张科李康李强
Owner FUJIAN ACETRON NEW MATERIALS CO LTD
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