A dynamic balance test and correction system for diamond micro-diameter milling cutter

Abstract

The invention discloses a dynamic balance test and correction system for a diamond micro-diameter milling cutter. The system includes two parts: a micro-grinding workbench and a dynamic balance measurement workbench, wherein: the micro-grinding workbench includes a precision air-floating spacer Vibration platform, base, precision motion table, piezoelectric ceramics, electric control rotary table, collet, CCD camera, CCD mounting frame, vertical one-dimensional precision guide rail, connecting plate, two-dimensional precision motion platform A, grinding axis Mounting frame, high-speed grinding spindle, pneumatic chuck A, grinding wheel grinding head, two-dimensional precision motion platform B; the dynamic balance measurement table includes photoelectric sensor, industrial computer, vibration sensor, dynamic balance spindle, pneumatic chuck B and Dynamic balancer. The system can detect the dynamic balance of the micro-milling cutter and deal with the unbalanced amount, and can solve the problem that the precision of the diamond micro-milling cutter is reduced during the micro-milling process due to the dynamic unbalanced amount after the diamond micro-milling cutter is prepared or worn.

Description

technical field [0001] The invention belongs to the technical field of tool manufacturing, and relates to a dynamic balance testing and correction device for a diamond micro-diameter milling cutter. Background technique [0002] With the continuous improvement of the industrial level, in the fields of aerospace, electronic technology, medical technology, optics and other fields, higher requirements have been put forward for micro-structures and high-precision machining methods. Micro-milling and other micro-machining technologies are irreplaceable in these fields. It is increasingly becoming the focus of subject and engineering research. [0003] At present, the preparation processes of micro-milling tools are mainly precision micro grinding, ultrasonic vibration grinding, focused ion beam sputtering, laser processing, wire electrode EDM grinding, etc. Since machining or wear will cause dynamic unbalance and affect the machining quality, the research on the dynamic balance ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a dynamic balance test and correction system for diamond micro-diameter milling cutters, which can detect the dynamic balance of micro-milling cutters and handle the unbalanced amount, and can solve the problem of diamond micro-milling cutters due to The problem that the dynamic unbalance leads to the reduction of precision in the process of micro-milling

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