Air-cooled heat dissipation flow type semiconductor refrigeration system and refrigeration equipment

Abstract

The invention relates to the field of refrigeration equipment and discloses an air-cooled heat dissipation flow type semiconductor refrigeration system and refrigeration equipment. The refrigeration system involves a storage container, a semiconductor refrigeration chip and an air-cooled hot end radiator in contact with the hot end of the semiconductor refrigeration chip, wherein a cold guide piece with an inner surface exposed to an inner cavity of the storage container is provided or integrally formed on one side of the storage container, the cold guide piece is in contact with the cold endof the semiconductor refrigeration chip, a liquid driving device is arranged on the storage container, the liquid driving device forms a liquid flow path with the storage container so that heat convection movement of drinking liquid can be guided in a working process through the liquid driving device, and a local turbulence forming structure for forming local turbulence of the liquid is arranged on the liquid flow path. According to the system and the equipment, the drinking liquid in different areas in the storage container is promoted to keep the temperature uniform through the liquid flow path, so that the refrigeration efficiency is effectively improved, and the refrigeration effect is enhanced.

Description

technical field [0001] The invention relates to the technical field of refrigeration, in particular to an air-cooled and heat-dissipating fluid semiconductor refrigeration system and refrigeration equipment provided with it. Background technique [0002] At present, there are two types of refrigeration methods in liquid refrigeration equipment: one uses a refrigeration compressor as the working part, and its principle is the same as that of a general refrigerator. Its advantages are fast cooling and large cooling capacity, but its disadvantages are complex structure and high price; Another kind of semiconductor refrigeration chip as the working part is a special refrigeration method using the Peltier effect. It has the advantages of simple structure, no refrigerant, more environmentally friendly, low noise, light weight, and high production technology. Small quantity. After the semiconductor refrigeration chip is energized, its two ends are heated on one side and cooled on ...

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Problems solved by technology

[0005] In order to overcome the deficiencies in the prior art, the basic technical problem to be solved by the present invention is to provide an air-cooled heat dissipation fluid semiconductor refrigeration system, which has a simple structure and can effectively solve the problem of semiconductor refrigeration chips in the prior art. The heat transfer speed is slow, the cooling efficiency is low, the temperature is uneven, etc.

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