Liquid crystal polymer film for flexible printed circuit board

A liquid crystal polymer, flexible printing technology, applied in flexible printed circuit boards, printed circuits, printed circuits, etc., can solve the problems of high frequency applications of flexible printed circuit boards, high dielectric constant and dielectric loss factor, and achieve Effects of low dielectric loss factor, low dielectric constant, good dielectric properties and mechanical properties

Active Publication Date: 2020-08-07
NINGBO CHANGYANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In traditional flexible printed circuit boards, the substrate is usually made of polyimide film. However, the dielectric constant of polyimide film is usually around 4.0, and the dielectric loss factor is usually 0.004 to 0.007. The dielectric constant and dielectric loss The factors are all high, which cannot meet the requirements of flexible printed circuit boards in high-frequency applications

Method used

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  • Liquid crystal polymer film for flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] According to the mass ratio, 75% of A950RX, 21% of DURAFIDE 1130A64, 3% of FG1901 and 1% of Luwax OP are mixed to form a mixture, and the mixture is placed in a twin-screw extruder for melt plasticization, twin-screw extrusion The temperature of the mixture in the discharge machine is 100°C-300°C, the temperature of the die head is 290°C-300°C, the temperature of the cold roll is 240°C, and the melted and plasticized preform is cast into a cast sheet to obtain a prefabricated film.

[0067] The prefabricated film is first stretched longitudinally at a stretching ratio of 2.5 times, and then stretched transversely at a stretching ratio of 3 times at a stretching temperature of 240°C. After stretching, it is wound and cut horizontally to prepare the thickness 50μm liquid crystal polymer film.

[0068] The above-mentioned liquid crystal polymer film is used as the material of the substrate of the flexible printed circuit board to prepare a flexible printed circuit board. ...

Embodiment 2

[0070] In terms of mass ratio, 80% of A950RX, 17.5% of DURAFIDE 1130A64, 2% of FG1901 and 0.5% of Luwax OP are mixed to form a mixture, and the mixture is placed in a twin-screw extruder for melt plasticization, twin-screw extrusion The temperature of the mixture in the discharge machine is 100°C-300°C, the temperature of the die head is 290°C-300°C, the temperature of the cold roll is 220°C, and the melted and plasticized preform is cast into a precast film to obtain a prefabricated film.

[0071] The prefabricated film is first stretched longitudinally, with a stretching ratio of 2 times, and then stretched transversely, with a stretching ratio of 2.5 times, and the stretching temperature is 250°C. After stretching, it is wound and cut horizontally to prepare the thickness 80μm liquid crystal polymer film.

[0072] The above-mentioned liquid crystal polymer film is used as the material of the substrate of the flexible printed circuit board to prepare a flexible printed circu...

Embodiment 3

[0074] According to the mass ratio, 85% of A950RX, 12.5% ​​of DURAFIDE 1130A64, 2% of FG1901 and 0.5% of Luwax OP are mixed to form a mixture, and the mixture is placed in a twin-screw extruder for melt plasticization, twin-screw extrusion The temperature of the mixture in the discharge machine is 100°C-300°C, the temperature of the die head is 290°C-300°C, the temperature of the cold roll is 220°C, and the melted and plasticized preform is cast into a precast film to obtain a prefabricated film.

[0075] The prefabricated film is first stretched longitudinally, with a stretching ratio of 3 times, and then stretched transversely, with a stretching ratio of 3 times, and the stretching temperature is 260°C. After stretching, it is wound and cut horizontally to prepare the thickness 100μm liquid crystal polymer film.

[0076] The above-mentioned liquid crystal polymer film is used as the material of the substrate of the flexible printed circuit board to prepare a flexible printed...

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Abstract

The invention provides a liquid crystal polymer film for a flexible printed circuit board. Materials of the liquid crystal polymer film comprise poly-p-phenylene dimethyl amide resin and polyphenylenesulfide resin, the longitudinal tensile strength of the liquid crystal polymer film is smaller than the transverse tensile strength, and the longitudinal elongation at break of the liquid crystal polymer film is larger than the transverse elongation at break of the liquid crystal polymer film. According to the invention, the isotropic liquid crystal polymer film is used as the material of a substrate of the flexible printed circuit board, so that the flexible printed circuit board has excellent dielectric properties and mechanical properties and meets the requirements in the field of high-frequency application.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a liquid crystal polymer film used for flexible printed circuit boards. Background technique [0002] Nowadays, with the rapid development of electronic information products, especially the 5G industry such as micron wave equipment, the requirements for flexible printed circuit boards (FPC) are also getting higher and higher. In traditional flexible printed circuit boards, the substrate is usually made of polyimide film. However, the dielectric constant of polyimide film is usually around 4.0, and the dielectric loss factor is usually 0.004 to 0.007. The dielectric constant and dielectric loss The factors are all high, which cannot meet the requirements of flexible printed circuit boards in high-frequency applications. Contents of the invention [0003] Based on this, it is necessary to provide a liquid crystal polymer film for flexible printed circuit boards to address t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08L81/02C08L51/06C08L53/02C08L91/06C08J5/18H05K1/03
CPCC08J5/18H05K1/0353C08J2377/06C08J2481/02H05K2201/0141H05K2201/05C08J2481/04C09K19/3809H05K1/0393C08J2377/10C08J2451/06C08L77/10C08L2203/16C08L81/02
Inventor 金亚东杨承翰周玉波王雄伟朱正平
Owner NINGBO CHANGYANG TECH
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