Laminating process of aluminum substrate

A lamination process and aluminum substrate technology, applied in lamination, lamination devices, layered products, etc., can solve problems affecting production efficiency, time-consuming, long completion time, etc., to improve board-forming efficiency and save time Effect

Inactive Publication Date: 2020-07-31
杭州盛浙电子有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0002] The existing production process of printed circuit boards is material cutting-inner layer-lamination-drilling-sinking copper-circuit---mapping-etching-soldering-character-spray tin-gong edge-v cutting- Flying test-vacuum packaging, in which the steps of heating, heat preservation and cooling of the board body are required in the lamination process to ensure that the prepreg can be well connected with the copper foil layer and the base layer, but the completion time of the traditional process is very long, which is mainly It is because the heating and cooling itself is very time-consuming, and the heat preservation process takes more than two hours, which makes the board forming time of the same batch of boards too long, affecting production efficiency

Method used

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  • Laminating process of aluminum substrate
  • Laminating process of aluminum substrate
  • Laminating process of aluminum substrate

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Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0024] Such as figure 1 As shown, this embodiment includes the following steps,

[0025] The positioning hole processing step is to process the positioning slot holes on the prepreg 2 and the substrate 3;

[0026] Etching step, the substrate 3 is etched;

[0027] The stacking step is to stack the plates in the carrier tray to form the primary plate body;

[0028] Heating step, copper foil 1, prepreg 2 and substrate 3 such as figure 2 The primary plates stacked in sequence as shown are heated to a rated high temperature until the prepreg 2 is heated to a liquid state;

[0029] Lamination step, using a laminator to laminate the primary board body at a high temperature rating;

[0030] In the cooling step, the primary plate body in lamination is cooled to a rated low temperature to form a secondary plate body, and the primary plate body is cooled to a rate...

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Abstract

A laminating process of an aluminum substrate at least comprises the following steps: a heating step of heating a primary plate body formed by sequentially laminating a copper foil, a prepreg and a substrate to a rated high temperature; a laminating step of laminating the primary plate body at the rated high temperature by using a laminating machine; a cooling step of cooling the laminated primaryplate body to a rated low temperature to form a secondary plate body; and a rewarming step of putting the secondary plate body into an oven, and heating for 0.8-1.2 hours at a rewarming temperature.A traditional heat preservation step is needed, a reheating step is added after the cooling step is finished to shorten the overall plate forming time, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a lamination process of an aluminum substrate. Background technique [0002] The existing production process of printed circuit boards is material cutting-inner layer-lamination-drilling-sinking copper-circuit---mapping-etching-soldering-character-spray tin-gong edge-v cutting- Flying test-vacuum packaging, in which the steps of heating, heat preservation and cooling of the board body are required in the lamination process to ensure that the prepreg can be well connected with the copper foil layer and the base layer, but the completion time of the traditional process is very long, which is mainly It is because the heating and cooling itself is very time-consuming, and the heat preservation process takes more than two hours, which makes the board forming time of the same batch of boards too long, which affects production efficiency. Contents of the inven...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46B32B15/04B32B15/20B32B37/00B32B37/06B32B37/10
CPCB32B15/04B32B15/20B32B37/0046B32B37/06B32B37/10H05K3/4644
Inventor 黄伟
Owner 杭州盛浙电子有限公司
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