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A kind of electroplating tin additive and its preparation method and use method

An additive and electroplating tin technology, applied in the field of electroplating tin additives and its preparation, can solve the problems of high tank changing frequency, low safety, low production efficiency, etc., and achieve extended tank life, excellent electroplating performance, and good anti-oxidation effect. Effect

Active Publication Date: 2020-12-25
GUANGDONG HAFU SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional electroplating tin additives are developed based on Longmen wire electroplating. However, compared with VCP lines, Longmen wires have lower production efficiency, higher cost, and lower safety. However, the application of traditional tin plating additives to VCP lines faces the following two problems: 1) Electroplating process A large number of air bubbles will be produced on the medium VCP line, which will easily cause missing plating and uneven coating.
2) The generation of a large number of bubbles will introduce more dissolved oxygen, resulting in too fast generation of tetravalent tin, resulting in high frequency of tank changes and increased costs

Method used

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  • A kind of electroplating tin additive and its preparation method and use method
  • A kind of electroplating tin additive and its preparation method and use method
  • A kind of electroplating tin additive and its preparation method and use method

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Experimental program
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Effect test

Embodiment 1-11

[0030] A preparation method of an electroplating tin additive, comprising the following steps:

[0031] (1) Add water to the container;

[0032] (2) In the case of stirring, add 1-phenyl-2-pentanone in proportion until completely dissolved;

[0033] (3) In the case of stirring, add antioxidants in proportion until completely dissolved;

[0034] (4) While stirring, add 1-(3,4-dihydroxyphenyl)-1-pentanone in proportion until completely dissolved;

[0035] (5) In the case of stirring, add the brightener in proportion until it is completely dissolved;

[0036] (6) In the case of stirring, add naphthol ethoxy sulfonic acid in proportion until completely dissolved;

[0037] (7) under the situation of stirring, add resorcinol in proportion until fully dissolved;

[0038] (8) Add water to the required amount, and stir well after completion.

[0039] The water is deionized water, the antioxidant is one of diisobutyl ketone and methyl isobutyl ketone, and the brightener is benzylid...

Embodiment 9

[0043] The concentration of each component in embodiment 9 is as shown in table 2:

[0044] Table 2: Each component content table (g / L) in the electroplating tin additive of embodiment 9

[0045]

Embodiment 10

[0046] The concentration of each component in embodiment 10 is as shown in table 3:

[0047] Table 3: Each component content table (g / L) in the electroplating tin additive of embodiment 10

[0048]

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Abstract

The invention discloses an electro-tinning additive. Water serves as a solvent, the electro-tinning additive comprises following components including, by concentration, 0.2-20 g / L of 1-phenyl-2-pentanone, 0.2-20 g / L of 1-(3,4-dyhydroxy phenyl)-1-pentanone, 0.2-20 g / L of naphthol ethoxy sulfonic acid, 1-20 g / L of resorcinol, 1-20 g / L of antioxidant and 1-30 g / L of brightener. By means of the electro-tinning additive, generation of bubbles in the electroplating process can be effectively reduced, oxygen dissolving is reduced, and the electroplating effect is guaranteed.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating tin additive and a preparation method and application method thereof. Background technique [0002] Printed Circuit Board (PCB) is one of the important parts of the electronics industry and is the support of electronic components. Generally, the process of manufacturing printed circuit boards includes double-sided copper cladding → mechanical processing → copper sinking → film (screen printing) → electroplating copper → electrotin plating → etching → stripping tin → processing. Traditional electroplating tin additives are developed based on gantry wire electroplating. However, compared with VCP lines, gantry wires have lower production efficiency, higher cost, and lower safety. However, the application of traditional tin plating additives to VCP lines faces the following two problems: 1) The electroplating process A large number of air bubbles will be pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 陈勇孙延一林建辉
Owner GUANGDONG HAFU SCI & TECH
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