Sensor, manufacturing method thereof, and electronic device
A manufacturing method and sensor technology, applied in the field of sensors, can solve the problems of poor chip heat dissipation effect and affect sensor performance, and achieve the effects of good heat dissipation effect, shortening production cycle and reducing production cost.
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[0061] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0062] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly. ...
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