Sensor, manufacturing method thereof, and electronic device

A manufacturing method and sensor technology, applied in the field of sensors, can solve the problems of poor chip heat dissipation effect and affect sensor performance, and achieve the effects of good heat dissipation effect, shortening production cycle and reducing production cost.

Active Publication Date: 2022-02-25
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sensor generally includes an electrically conductive sensor chip and an integrated circuit chip. In related technologies, in order to shield the external electromagnetic interference on the integrated circuit chip, the method of covering the chip is usually used, but this method easily leads to poor heat dissipation effect of the chip. thereby affecting the performance of the sensor

Method used

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  • Sensor, manufacturing method thereof, and electronic device
  • Sensor, manufacturing method thereof, and electronic device
  • Sensor, manufacturing method thereof, and electronic device

Examples

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Embodiment Construction

[0061] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0062] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly. ...

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Abstract

The invention discloses a sensor, a manufacturing method thereof, and electronic equipment. Wherein, the sensor includes: a substrate, the substrate is provided with a pad and a first conductive structure that are insulated from each other and partially exposed on the surface, and a surface of the substrate is also provided with a pad that is electrically connected to the pad. The heat conduction limiting groove; the integrated circuit chip, the integrated circuit chip is arranged in the heat conduction limiting groove, and is electrically connected to the first conductive structure through the connecting wire; and the shielding structure, the shielding structure includes cover the integrated circuit chip. The technical scheme of the invention can shield the chip from external electromagnetic interference, and at the same time improve the cooling effect of the chip.

Description

technical field [0001] The present invention relates to the technical field of sensors, and in particular, to a sensor and a manufacturing method thereof, and an electronic device. Background technique [0002] With the development trend of mobile phones, watches, earphones and other consumer electronic products towards "light, thin, short and small", the development direction of their core components and sensors is also developing towards miniaturization and integration. The sensor generally includes an electrically conductive sensor chip and an integrated circuit chip. In the related art, in order to shield the external electromagnetic interference to the integrated circuit chip, the method of wrapping the chip is usually adopted, but this method easily leads to poor heat dissipation effect of the chip. This affects the performance of the sensor. [0003] The above content is only used to assist the understanding of the technical solutions of the present invention, and do...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552H01L23/367H01L25/16H01L21/50
CPCH01L23/552H01L23/367H01L25/16H01L21/50H01L2924/3025H01L2924/15151H01L2924/15192H01L2924/15153H01L2224/48227H01L2224/73265
Inventor 邱文瑞王德信刘兵
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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