Solar cell and laser slicing method

Abstract

The invention provides a solar cell and a laser slicing method, and belongs to the technical field of photovoltaics. The solar cell comprises a cell body, wherein at least one non-emitter region is arranged on the front surface of the cell body. The method specifically comprises the following steps: cutting off phosphosilicate glass or borosilicate glass on one surface, having a p-n junction, of acell body by using laser at a subsequent laser slicing position, removing the p-n structure of the film opening region in a wet etching, dry etching or mechanical etching mode to form an emitter-freeregion, manufacturing a cell, and then cutting along the emitter-free region on the front surface by using laser or cutting along the region on the back surface of the cell corresponding to the emitter-free region on the front surface to crack the cell body. According to the invention, the damage of laser cutting to a p-n junction can be eliminated, so that the decrease of the fill factor of thesolar cell due to laser cutting is significantly weakened.

Description

technical field [0001] The invention belongs to the technical field of photovoltaics, and relates to a solar cell and a laser slicing method. Background technique [0002] Laser slicing technology is a high-efficiency technology developed on the photovoltaic module side in recent years. It is widely used in the production of half-cut modules and shingled modules, and the power of modules can be significantly improved. However, laser cutting damage leads to the loss of efficiency of cut solar cells, which in turn weakens the power gain of half-cut modules or shingled modules. [0003] The fill factor of the crystalline silicon solar cell prepared in the prior art will be significantly reduced after laser cutting in half, which in turn will cause a decrease in photoelectric conversion efficiency. Taking PERC solar cells as an example, the efficiency of the half cell after laser cutting in half will decrease by about 0.1%-0.2% %abs, taking the TOPCon battery as an example, the...

AI Technical Summary

Problems solved by technology

However, laser cutting damage leads to the loss of efficiency of cut solar cells, which in turn reduces the power gain of half-cut modules or shingled modules

[0003] The fill factor of the crystalline silicon solar cell prepared in the prior art will be significantly reduced after laser cutting in half, which in turn will cause a decrease in photoelectric conversion efficiency. Taking PERC solar cells as an example, the efficiency of the half cell after laser cutting in half will decrease by about 0.1%-0.2% %abs, taking the TOPCon battery as an example, the efficiency of the half-cell after laser cutting in half is reduced by about 0.2-0.3%abs

Recently, some companies use larger-sized silicon wafers to make solar cells, such as 210mm×210mm silicon wafers. When making components, the solar cells will be cut into three parts by laser, which will inevitably make the two sides of the sun cut by laser. The efficiency of the cell is reduced more, which causes the mismatch of the cell string welding

Similarly, shingled modules require cutting a solar cell into multiple parts, and the efficiency of the cell is reduced more significantly

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