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Microsystem packaging method

A packaging method and microsystem technology, applied in the field of microsystems, can solve problems such as inability to reuse and narrow application range of microsystems, and achieve the effects of expanding applicable scenarios, improving integration and mass production, and improving openness

Pending Publication Date: 2020-07-17
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a microsystem packaging method in view of the problem that the microsystem in the traditional solution has a narrow application range and cannot be reused

Method used

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preparation example Construction

[0043] The preparation of existing sensing microsystems includes three main parts: microsensor integration, microelectronic integration, and packaging and molding. Among them, microelectronics integration and packaging molding have relatively uniform industry standards, while microsensors face natural objects with many types and various parameters, so the standards for various application industries are not uniform. Therefore, considering that the existing sensing microsystems rely on one-time molding process, the process coupling relationship between the integration of microsensors and the integration of other common parts (including microelectronics integration and package molding) is too tight, resulting in premature sealing of microsensors In the microsystem, there is a lack of open microsystem packaging and processing solutions. This application provides a microsystem packaging method, which can keep the microsystem body (microelectronic circuit and package body) unchanged...

Embodiment 1

[0067] Embodiment 1: The structure and process of the precision machining open microsystem and its secondary integration of mechanical microsensors.

[0068] Please also see Figure 2-Figure 3 , to describe the specific structure of the prefabrication of the open microsystem in this embodiment. Wherein, the substrate 10 can be an FR4 printed circuit board with a size of 10mm×10mm×0.8mm, and the open interface electrodes 20 integrally formed on the upper surface thereof are two sets of electrode arrays, and each group of arrays is distributed on an area of ​​4mm×4mm. Each includes five 0.8mm×0.5mm immersion gold copper pads on the surface, and the thickness of the immersion gold is 2 microns. The micro-device general circuit 30 can be a general circuit composed of AD8235 differential instrumentation amplifier, CC1350 wireless microcontroller, RT9078 power management chip and several 0201 package resistors, capacitors, and inductors, occupying an area of ​​8mm×4mm, which is dif...

Embodiment 2

[0077] Embodiment 2: The structure and process of cofferdam filling open microsystem and its secondary integration of magnetic intensity microsensors.

[0078] Please also see Figure 2-Figure 3 , to describe the specific structure of the prefabrication of the open microsystem in this embodiment. Among them, the substrate 10 can be a high-density BT resin substrate of 12mm×12mm×0.5mm, and the open interface electrode 20 can be a group of electrode arrays located on the upper surface of the substrate 10 and integrally formed with the substrate 10, distributed in a 9.8mm×4.9mm In the area of ​​, there are 27 gold-plated copper pads of 0.8mm×0.5mm in total, and the thickness of the gold-plated layer is 2 microns. The micro-device general circuit 30 can be a general circuit located on the upper surface of the substrate 10 and composed of AD8235 differential instrumentation amplifier, CC1350 wireless microcontroller, RT9078 power management chip and several 0201 packaged resistors...

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Abstract

The invention relates to a microsystem packaging method. According to the micro-system packaging method, an interface electrode and a micro-device universal circuit are integrated on a substrate, andthe preformed packaging body with at least one open cavity is formed on one side, facing the micro-device universal circuit, of the substrate, so that the integration of a micro-system architecture can be completed. The integration level and the mass production of the micro-system architecture can be improved by wrapping the micro-device universal circuit with a preformed packaging body; the openness of the micro-system architecture can be improved by exposing the interface electrode in the open cavity, the open interface electrode is provided for subsequently integrating and packaging a microdevice on the interface electrode, and flexible model selection and scene application of the micro device can be realized.

Description

technical field [0001] The present application relates to the technical field of microsystems, in particular to a microsystem packaging method. Background technique [0002] As human society has fully entered the information age, more and more scenes and objects need to be monitored in real time in production and life, such as the operation status of vehicles, the safety of urban pipeline corridor lines, the real-time status of logistics goods, and the health of the environment and human beings. Since the above-mentioned monitoring requirements have the characteristics of low information density, wide distribution range, difficult maintenance and management, and low added value, it puts forward higher requirements for the volume, power consumption, cost, information fusion, and intelligence of the sensing system. , the traditional sensing system is not competent. [0003] The emergence of microsensors makes it possible to realize miniaturized, lightweight, low-cost, and int...

Claims

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Application Information

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IPC IPC(8): B81C1/00H05K3/30
CPCB81C1/00222B81C1/00246H05K3/303
Inventor 尤政鲁文帅尤睿阮勇
Owner TSINGHUA UNIV
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