Die for preventing chip from falling

Abstract

The invention aims to provide adie for preventing achip from falling, and avoids the situation that defective products cannot be detected and flow to customers. The die comprises an upper clamp, a lower clamp, a substrate and a chip, wherein the chip is arranged on the substrate; the upper clamp is matched with the lower clamp to fix the chip on the substrate. The beneficial effects of the invention are that the method can solve a problem that a chip falls off through employing the special clamp, can reduce the frequency of manual inspection, reduces the probability of quality risks, and improves the reliability of a product.

Description

technical field [0001] The invention relates to a mold for encapsulating semiconductor integrated circuits, in particular to a mold for preventing chips from falling. Background technique [0002] In the Flip Chip Bonding (chip flip-chip welding) project of a semiconductor packaging and testing company, the frequent occurrence of false soldering causes the chip to fall off, which leads to the problem of chip leakage in the Molding (plastic packaging) project. The actual operation of a domestic Sino-Korean joint venture packaging and testing factory During the process, the number of defective parts per month was 16, which not only brought bad conditions to the production, but also caused other chips to be crushed due to the fallen chips under the high-pressure mold. Since the defect cannot be detected after plastic sealing in the case of mass production, there is a risk of passing the defect to the customer. [0003] A Chinese invention patent has been published, publication...

AI Technical Summary

Problems solved by technology

[0002] In the Flip Chip Bonding (chip flip-chip welding) project of a semiconductor packaging and testing company, the frequent occurrence of false soldering causes the chip to fall off, which leads to the problem of chip leakage in the Molding (plastic packaging) project. The actual operation of a domestic Sino-Korean joint venture packaging and testing factory During the process, the number of defective parts per month was 16, which not only brought bad conditions to the production, but also caused other chips to be crushed due to the fallen chips under the high-pressure mold.

Due to the failure to detect defects after plastic sealing in mass production, there is a risk of passing defects to customers

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