Product label error prevention device of wafer cutting machine
A wafer slicing machine and slicing machine technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as abnormal product quality, label peeling, abnormal product mixing, etc.
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[0015] Depend on figure 1 As can be seen, this patent includes a product label, the product label is placed on the exposed adhesive layer next to the wafer, under the non-stick laminate, the bottom of the adhesive layer is the base film, and the non-stick laminate is made of iron fluorine dragon material.
[0016] Preferably, a barcode recognizer is also included, the barcode recognizer is placed at the feed and discharge positions of the splitter, the barcode recognizer is used to scan the product label, the barcode recognizer performs data interaction with the server, and uses the product Label identification and alarm, used to record information collection and comparison of product labels entering and exiting equipment.
[0017] Before the equipment feeds, first identify the product label information of the current operating product; after the wafer splitting operation is completed, identify the product label information again when the material is discharged, and after cap...
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