Method for producing substrate for flexible device

A manufacturing method, heat resistance technology, applied in the direction of chemical instruments and methods, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as difficulty in preventing wrinkles, cracks, difficulty in maintaining positional accuracy and dimensional accuracy, and achieve low-line Expansion coefficient, good reproducibility, low delay effect

Active Publication Date: 2020-06-26
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] On the other hand, when pursuing the advantages of plastic substrates, it is the handleability and dimensional stability of the plastic substrate itself.
That is, if the plastic substrate is made into a thin film, it is difficult to prevent wrinkles and cracks from occurring, and it is difficult to maintain the positional accuracy when laminating functional layers such as thin-film transistors (TFTs) and electrodes, and the dimensions after forming the functional layers. precision

Method used

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  • Method for producing substrate for flexible device
  • Method for producing substrate for flexible device
  • Method for producing substrate for flexible device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0230] Hereinafter, although an Example is given and this invention is demonstrated more concretely, this invention is not limited to a following Example.

[0231] The meanings of the abbreviated symbols used in the following examples are as follows.

[0232]

[0233] BODAxx: Bicyclo[2,2,2]octane-2,3,5,6-tetracarboxylic dianhydride

[0234] CBDA: 1,2,3,4-cyclobutane tetracarboxylic dianhydride

[0235]

[0236] TFMB: 2,2’-bis(trifluoromethyl)benzidine

[0237]

[0238] GBL: gamma-butyrolactone

[0239] In addition, in the examples, the apparatus and conditions used for preparation of samples and analysis and evaluation of physical properties are as follows.

[0240] 1) Determination of number average molecular weight and weight average molecular weight

[0241] Number-average molecular weight (hereinafter, abbreviated as Mn) and weight-average molecular weight (hereinafter, abbreviated as Mw) of the polymer in the device: Showdex GPC-101 manufactured by Showa Denko C...

Synthetic example 1

[0268] Synthesis Example 1: Synthesis of Polyimide A (PI-A)

[0269] 25.61 g (0.08 mol) of TFMB was charged in a 250 mL reaction three-necked flask equipped with a nitrogen inlet / outlet, a mechanical stirrer, and a cooler. Then, GBL 173.86g was added, and stirring was started. After the diamine was completely dissolved in the solvent, 10 g (0.04 mol) of BODAxx, 7.84 g (0.04 mol) of CBDA, and 43.4 g of GBL were added immediately after stirring, and heated to 140° C. under nitrogen. Then, 0.348 g of 1-ethylpiperidine was added to the solution, followed by heating at 180° C. for 7 hours under nitrogen. Finally the heating was turned off and the reaction solution was diluted until 10% and kept stirring overnight. After adding the polyimide reaction solution to 2000 g of methanol and stirring for 30 minutes, the polyimide solid was filtered and the polyimide was purified. Furthermore, this polyimide solid was stirred in 2000 g of methanol for 30 minutes, and the polyimide solid ...

example 1

[0271] Example 1: Formation of peeling layer

[0272] At room temperature, 1 g of the polyimide (PI-A) of Synthesis Example 1 was dissolved in the GBL solvent so as to be 8% by mass through a 1 μm filter and gradually filtered under pressure to obtain Composition for forming a release layer. Then, the composition was coated on a glass support substrate, and fired at a temperature of 50° C. for 30 minutes, 140° C. for 30 minutes, and 200° C. for 60 minutes in an air atmosphere. Furthermore, it baked at 300 degreeC for 60 minutes. In this way, a transparent polyimide film was formed as a release layer on the glass support substrate. Table 1 shows its optical and thermal properties.

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Abstract

The purpose of the present invention is to provide a method for forming a resin thin film laminate that makes it possible to preserve the exceptional performance attributes of exceptional heat resistance, low retardation, exceptional flexibility, and exceptional transparency, said resin thin film laminate being applied to a plastic thin film having exceptional performance as a base film of a flexible device substrate such as a flexible display substrate that can be easily peeled from a glass carrier. A method for producing a resin thin film laminate, said resin thin film laminate being characterized in that after a peeling layer is formed on a support substrate using a peeling-layer-forming composition containing a heat resistant polymer and an organic solvent, a resin thin film is formedon the peeling layer using a resin thin film-forming composition containing a heat resistant polymer and an organic solvent, and the peeling layer and the resin thin film are subsequently peeled fromthe support substrate as a single entity, said method being further characterized in that silicon dioxide particles having an average particle diameter of 100 nm or less as calculated from the specific surface area measured by nitrogen adsorption are incorporated in substantially only the resin thin film-forming composition.

Description

technical field [0001] The present invention relates to a method for producing a resin film laminate serving as a substrate for flexible devices, especially a base film of a flexible printed substrate such as a flexible display, and more specifically relates to a transparent laminate laminated on a support substrate. heat-resistant polymer laminates. Background technique [0002] In recent years, with the rapid progress of electronic devices such as liquid crystal displays and organic electroluminescence displays, thinning, lightening, and flexibility of devices are required. [0003] In these devices, various electronic components, such as thin film transistors, transparent electrodes, etc., are formed on glass substrates, but it is expected that by replacing the glass material with a soft and lightweight resin material, the device itself can be thinned, Lightweight and flexible. [0004] As a candidate of such a resin material, polyimide attracts attention, and various r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C41/22B32B27/20B32B27/34C08G73/10
CPCB29C41/22B32B27/20B32B27/34C08G73/10B29C41/003B32B27/281C08G73/1039C08G73/1078C08K3/36C08L79/08C08K2201/011
Inventor 江原和也叶镇嘉
Owner NISSAN CHEM IND LTD
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