Processing technology of planar thick copper PCB

A processing technology, PCB board technology, applied in the field of flat thick copper PCB processing technology, can solve problems such as unable to rotate smoothly, complex structure, pointer blocking, etc., and achieve the effect of improving the sensitivity of use

Pending Publication Date: 2020-06-23
四川英创力电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The structure of multi-turn precision wire-wound potentiometers is becoming more and more sophisticated, and the structure is becoming more and more complex
A pointer is installed in the multi-turn precision wire-wound potentiometer. The pointer is installed on the printed board. The pointer rotates 360° on the printed board. To rotate the pointer smoothly, it must ensure that the rotation plane of the pointer and the conductive conductor on the printed board The graphics are on the same side, so that the pointer can rotate smoothly. If there is no conductive pattern on the printed board and the rotation plane of the pointer is not on the same plane, the pointer will be blocked by the conductive pattern and cannot rotate smoothly.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment one: a kind of processing technology of planar thick copper PCB, it comprises the following steps:

[0021] S1. Forming of semi-finished PCB boards for multi-turn precision wire-wound potentiometers: successively through material cutting, inner layer circuit making, inner layer etching treatment, browning treatment, first pressing treatment, drilling treatment, copper sinking treatment, full Board copper plating treatment, making outer layer circuit, pattern electroplating treatment, outer layer etching treatment and second pressing treatment; in which the first pressing treatment is carried out in accordance with the multi-layer board manufacturing process specification, and it is used in pressing 4OZ copper foil, after pressing, a semi-finished PCB board for multi-turn precision wire-wound potentiometers is produced; in the second pressing process, two overlapping 106 prepregs and Two 1080 prepregs are placed and pressed for the second time, and the pressin...

Embodiment 2

[0029] Embodiment two: a kind of processing technology of planar thick copper PCB, it comprises the following steps:

[0030] S1. Forming of semi-finished PCB boards for multi-turn precision wire-wound potentiometers: successively through material cutting, inner layer circuit making, inner layer etching treatment, browning treatment, first pressing treatment, drilling treatment, copper sinking treatment, full Board copper plating treatment, making outer layer circuit, pattern electroplating treatment, outer layer etching treatment and second pressing treatment; in which the first pressing treatment is carried out in accordance with the multi-layer board manufacturing process specification, and it is used in pressing 4OZ copper foil, after pressing, a semi-finished PCB board for multi-turn precision wire-wound potentiometers is produced; in the second pressing process, two overlapping 106 prepregs and Two 1080 prepregs are placed and pressed for the second time, and the pressin...

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PUM

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Abstract

The invention discloses a processing technology of a planar thick copper PCB. The technology comprises: S2, enabling an upper surface circuit and a lower surface circuit of a semi-finished PCB to be covered by resin in prepregs, and enabling the circuits to be filled and leveled up by the resin in the prepregs; S3, grinding off redundant resin on the surface circuit by using a ceramic grinding brush on grinding equipment so as to ensure that the conductive pattern of the surface circuit is just exposed; S4, the grinding frequency is controlled within 5-6 times, and at the moment, the exposed circuits and the resin filled between the circuits are located on the same plane; S6, performing surface treatment on the pattern of the PCB for the multi-turn precision wire-wound potentiometer; and checking the PCB after surface treatment, thereby finally obtaining the finished product of the PCB for the multi-turn precision wire-wound potentiometer. The invention has the beneficial effects thatthe pointer and the base material can be leveled into the same plane, the pointer can be ensured to smoothly rotate after being assembled by a user, and the contact sensitivity of a product is improved.

Description

technical field [0001] The invention relates to the technical field of plane thick copper PCB processing, in particular to a plane thick copper PCB processing technology. Background technique [0002] At present, as electronic products tend to be more and more miniaturized and highly integrated, printed circuit boards are developing in the direction of small, thin, high-density, multi-layer, thick copper foil, and small aperture. Among them, printed boards are widely used in some high-power electrical equipment, power supply equipment and other fields. The circuit board needs to carry high voltage and high current to ensure normal function. The structure of multi-turn precision wire-wound potentiometers is becoming more and more sophisticated, and the structure is becoming more and more complex. A pointer is installed in the multi-turn precision wire-wound potentiometer. The pointer is installed on the printed board. The pointer rotates 360° on the printed board. To rotate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/04
CPCH05K3/04
Inventor 李清华张仁军黄伟杰彭书建吴国栋
Owner 四川英创力电子科技股份有限公司
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