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Silver paste for multilayer wiring of low-temperature co-fired low-dielectric-constant dielectric ceramic

A low dielectric constant, dielectric ceramic technology, applied in the field of materials, can solve problems such as unsuitable co-firing temperature, sintering mismatch, etc., and achieve the effect of eliminating silver diffusion phenomenon, clear pattern and excellent performance

Active Publication Date: 2020-06-19
LUOYANG INST OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Application number: 201910312643.2 "A conductive silver paste for low-temperature sintering LTCC" solves the problem of sintering mismatch between DuPont paste and self-made LTCC ceramic material. Its sintering temperature is 600-650°C, which is mainly used for multilayer ceramic capacitors Low-temperature co-fired ceramic system with a co-firing temperature of 850-900°C

Method used

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  • Silver paste for multilayer wiring of low-temperature co-fired low-dielectric-constant dielectric ceramic
  • Silver paste for multilayer wiring of low-temperature co-fired low-dielectric-constant dielectric ceramic

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Experimental program
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Effect test

Embodiment 1

[0037] Sampling according to the following mass percentages: spherical silver powder 80wt%, aluminum borosilicate barium glass powder 0.5wt%, inorganic modifier TiO 2 0.5wt%, Fe 2 o 3 0.2wt%, organic vehicle 18.8wt%. The D50 of the spherical silver powder is 2.3 μm, and the tap density is 4.9 g / cm3. The preparation method is as described above. The prepared slurry has a viscosity of 260±50dPa ▪S, a slurry fineness≦8μm, and a solid content of 81.2%. It is used to make four-layer co-fired test samples, and the test results are shown in Table 2.

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Abstract

The invention relates to silver paste for multilayer wiring of low-temperature co-fired low-dielectric-constant dielectric ceramic, which belongs to the technical field of materials. The silver pastecomprises the components of, by mass, 80 to 90% of silver powder, 0.2 to 5% of an inorganic modifier, 0 to 3% of glass powder and 8 to 19.5% of an organic carrier. The silver paste can be co-fired with a microcrystalline glass and glass ceramic composite system low-temperature co-fired ceramic green tape at 850 DEG C, and has excellent matching performance. According to the multilayer wiring structure made of the silver paste, conductor silver wire patterns are clear, surrounding porcelain bodies do not turn yellow, and the bad silver diffusion phenomenon is eliminated.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to a silver paste, in particular to a silver paste for multilayer wiring used in low-permittivity co-fired dielectric ceramics. Background technique [0002] Low temperature co-fired ceramics (LTCC) technology is widely used in multilayer discrete components, such as capacitors, resistors, inductors, transformers; multilayer radio frequency, microwave, millimeter wave passive components; multilayer interconnect substrates and surface acoustic wave (SAW ) devices, and Si, GaAs, InP and other microwave devices and IC packaging, including traditional packaging forms to PGA, BGA, LCC, MCM-C, MCM-C / D, MEMS devices and module packaging and other system SIP (System in Package) package. Various products based on low-temperature co-fired ceramic technology are widely used in computer, communication, automobile, aerospace, biomedical, lighting, Internet of Things and other fields. It is an ...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22
CPCH01B1/16H01B1/22
Inventor 郝晓光周世平
Owner LUOYANG INST OF SCI & TECH
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