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Phenolic resin and preparation method thereof, and photoresist

A phenolic resin and photoresist technology, applied in the direction of photosensitive materials used in optomechanical equipment, can solve problems such as poor thermal stability, and achieve the effects of good thermal stability, high print resistance, and improved thermal stability.

Pending Publication Date: 2020-06-19
SHANGHAI PHICHEM MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the inventors have found that the thermal stability of the photoresist prepared using the novolac resin provided by the prior art is relatively poor

Method used

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  • Phenolic resin and preparation method thereof, and photoresist
  • Phenolic resin and preparation method thereof, and photoresist
  • Phenolic resin and preparation method thereof, and photoresist

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preparation example Construction

[0037] On the other hand, the embodiment of the present invention also provides a preparation method of phenolic resin, the preparation method includes: obtaining reaction raw materials, the reaction raw materials include: p-cresol, m-cresol and phenolic compounds.

[0038] Under the action of an acidic catalyst, the reaction raw materials and formaldehyde are subjected to addition polycondensation reaction to obtain an intermediate product.

[0039] The intermediate product is distilled to obtain phenolic resin.

[0040] Wherein, the chemical structural formula of phenolic compound is as follows:

[0041]

[0042] R 1 selected from CH 3 、CH 2 CH 3 or H;

[0043] R 2 and R 3 are selected from H, CH 3 or CH 2 CH 3 .

[0044] For example, the phenolic compound can be o-phenylphenol, whose chemical structural formula is:

[0045] Utilizing the method provided in the embodiments of the present invention, not only can the phenolic resin with the above-mentioned c...

Embodiment 1

[0077] This embodiment provides a phenolic resin, which is prepared by the following method: fully stir and mix 100g p-cresol, 100g m-cresol, 2g o-phenylphenol, and 1.17g oxalic acid, and slowly heat up to 85- At 90°C, 105.08g of formaldehyde aqueous solution (mass concentration: 37%) was slowly added dropwise into the reaction system within 1 hour, and the reaction temperature of the reaction system was controlled at 100°C throughout the process. After the addition of formaldehyde was completed, the reaction was refluxed at 100° C. for 3 h to obtain an intermediate product.

[0078] Then raise the temperature, increase the nitrogen flow rate to 1ml / s, and remove the moisture in the reaction system under normal pressure; after the temperature of the reaction system rises to 160°C, turn on the vacuum pump, the vacuum degree is -0.1MPa, and the decompression stripping system does not completely react Continue to raise the temperature to 200°C and keep it for 2 hours. After confi...

Embodiment 2

[0084] 100g of p-cresol, 100g of m-cresol, 1g of o-phenylphenol, and 1.17g of oxalic acid were fully stirred and mixed, and the temperature was slowly raised to 85-90°C under a nitrogen atmosphere, and 107.08g of formaldehyde aqueous solution (mass concentration: 37%) was mixed in 1h Slowly added dropwise to the reaction system within the whole process, the reaction temperature of the system was controlled at 95°C. After the addition of formaldehyde was completed, the reaction was refluxed at 100° C. for 3 h to obtain an intermediate product.

[0085] Then raise the temperature, increase the nitrogen flow rate to 1ml / s, and remove the moisture in the reaction system under normal pressure; after the temperature of the reaction system rises to 160°C, turn on the vacuum pump, the vacuum degree is -0.095MPa, and the decompression stripping system does not completely react Continue to raise the temperature to 200°C and keep it for 2 hours. After confirming that the phenolic monomer...

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Abstract

The invention discloses a phenolic resin and a preparation method thereof, and a photoresist. The preparation method of the phenolic resin comprises the following steps: obtaining reaction raw materials p-cresol, m-cresol and a phenol compound; under the action of an acidic catalyst, carrying out an addition condensation polymerization reaction on the reaction raw materials and formaldehyde to obtain an intermediate product; and distilling the intermediate product to obtain the phenolic resin, wherein the chemical structural formula of the phenol compound is defined in the specification, R1 isselected from CH3, CH2CH3 and H, and R2 and R3 are both selected from H, CH3 and CH2CH3. The prepared phenolic resin has good thermal stability, has the advantages of narrow molecular weight distribution, adjustable and controllable dissolving speed in a developing solution and good developing performance, heat resistance and resolution, is suitable for preparing positive photoresist such as LCDpositive photoresist, and endows the positive photoresist with good thermal stability, high pressrun and good development performance and resolution.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a phenolic resin, a preparation method thereof, and a photoresist. Background technique [0002] Photoresist, also known as photoresist, is one of the key materials for fine pattern processing in microelectronics technology. It is divided into positive photoresist and negative photoresist according to the difference in solubility after illumination. It includes at least : Film-forming resin, photosensitive compound and solvent. As a commonly used alkali-soluble film-forming resin, phenolic resin is widely used in positive photoresist, which directly affects the performance of photoresist, especially the resolution. Therefore, it is very necessary to provide a phenolic resin suitable for positive photoresists. [0003] The prior art provides a novolac resin, which is formed by polycondensation of phenolic compounds, aldehyde compounds and / or vinyl compounds. [0004] However, t...

Claims

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Application Information

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IPC IPC(8): C08G8/12C08G8/08G03F7/004
CPCC08G8/12C08G8/08G03F7/004
Inventor 刘俊伟张志鹏苟金龙李少志周家栋
Owner SHANGHAI PHICHEM MATERIAL CO LTD
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