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Manufacturing method of multi-layer copper-based sandwich bent plate

A manufacturing method and technology of bending boards, which are applied in the manufacture of multilayer circuits, processing of insulating substrates/layers, removal of conductive materials by chemical/electrolytic methods, etc., can solve the problems of high production cost, low quality and yield, production Process complexity and other issues, to achieve the effect of improving production efficiency and quality yield, reducing production costs, and optimizing processes

Pending Publication Date: 2020-06-16
黄石星河电路有限公司
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AI Technical Summary

Problems solved by technology

[0002] In the printed circuit board manufacturing industry, the processing technology for ordinary copper substrates has mature processing technology, but for multi-layer copper-based sandwich bending boards (copper-based sandwich thickness ≤ 1.5MM, the board is four The processing of basic sandwich bending plate) lacks mature processing technology, and generally adopts the processing method of ordinary four-layer copper substrate, which leads to complicated production process, low production efficiency, high production cost and high quality in the processing process. Problems such as low yield

Method used

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Embodiment Construction

[0031] The present invention will be further described below in conjunction with specific examples, so that those skilled in the art can better understand the present invention and implement it, but the enumerated examples are not intended as limitations of the present invention.

[0032] The invention provides a method for manufacturing a multi-layer copper-based sandwich bent plate, comprising the following steps:

[0033] Step 1: Take a large copper plate, use the CNC punching machine to complete the process of cutting, punching and punching holes at one time based on the CNC graphics designed according to the project needs, and cut the copper plate before using it compared with the ordinary method The gong machine cleans the slot holes, which can avoid the bad quality phenomena such as burrs and burrs in the process of material cutting, gong holes and slot holes;

[0034] Step 2: According to the cutting size designed according to the engineering needs, use the automatic c...

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Abstract

The invention discloses a manufacturing method of a multilayer copper-based sandwich bent plate. The method comprises the steps of sandwich copper base and FR4 board cutting, FR4 board inner layer circuit manufacturing, high-temperature glue pasting, press fit, drilling, copper deposition plate electroplating, outer layer circuit manufacturing, pattern electroplating, outer layer etching, outer layer A01 detection, soldermask process, forming, high-temperature glue tearing, FQC1, tin deposition, copper base bending, FQC2 and final packaging process. According to the manufacturing method, the cost of an FR4 plate is reduced; the production efficiency and yield of the plate are improved; production cost is reduced; and the manufacturing process of the sandwich copper-based bent plate is simplified.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a multilayer copper-based sandwich bending board. Background technique [0002] In the printed circuit board manufacturing industry, the processing technology for ordinary copper substrates has mature processing technology, but for multi-layer copper-based sandwich bending boards (copper-based sandwich thickness ≤ 1.5MM, the board is four The processing of base sandwich bending plate) lacks mature processing technology, and generally adopts the processing method of ordinary four-layer copper substrate, which leads to complicated production process, low production efficiency, high production cost and high quality in the processing process. Low yield and other issues. Contents of the invention [0003] The object of the present invention is to provide a method for manufacturing a multi-layer copper-based sandwich bent plate, so as to sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06H05K3/46
CPCH05K3/0044H05K3/0094H05K3/0052H05K3/06H05K3/4611
Inventor 张军刘智哲
Owner 黄石星河电路有限公司
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