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Soft multi-core group ceramic capacitor and production method thereof

A technology of ceramic capacitors and production methods, which is applied in the manufacture of multiple fixed capacitors, capacitors, capacitors, etc., can solve the problems of long development cycle of molded packaging molds, single product shape and structure, long design and development cycle, etc., to achieve strong shock resistance and Effects of environmental adaptability, rich appearance, and shortened R&D cycle

Pending Publication Date: 2020-06-05
FUJIAN TORCH ELECTRON TECH CO LTD
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AI Technical Summary

Problems solved by technology

[0002] Traditional soft multi-core group ceramic capacitors are usually molded and packaged through packaging molds. However, the development cycle of molded packaging molds is long (usually 6-12 months) and the cost is expensive. Design the welding frame inside the capacitor, the number of ceramic capacitor chips and the arrangement of the chips on the welding frame according to the external dimension specifications, which leads to the defects of single product structure and long design and development cycle

Method used

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  • Soft multi-core group ceramic capacitor and production method thereof
  • Soft multi-core group ceramic capacitor and production method thereof

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Embodiment Construction

[0028] Such as figure 1 and figure 2 As shown, the soft multi-core group ceramic capacitor includes a frame, four ceramic capacitor chips 2 welded on the frame, an insulating layer 3 coated on the surface of the capacitor chip, an encapsulation layer 4 arranged on the surface of the insulating layer 3 and coated on the The protective layer 5 on the surface of the packaging adhesive layer 4, the frame has two pins 11 arranged at relative intervals, the pins 11 pass through the insulating layer 3, the packaging adhesive layer 4, and the protective layer 5 respectively, and the packaging adhesive layer 4 is semi-solidified , two ceramic capacitor chips 2 are respectively welded on the upper and lower sides of the frame.

[0029] The frame also includes two chip pads respectively arranged on the upper ends of the two pins 11 and arranged relatively horizontally, two-pin pads 14 respectively arranged on the lower ends of the two pins 11 and arranged relatively horizontally, and t...

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Abstract

The invention provides a production method of a soft multi-core group ceramic capacitor. The production method comprises the steps of A welding a plurality of ceramic capacitor chips on a frame; B designing a packaging mold according to the welded structure of the frame and the ceramic capacitor chips, and printing the packaging mold through a 3D printing technology; C coating an insulating layeron the surface of the welded capacitor chips; D placing the frame and the ceramic capacitor chips processed in the step C in the packaging mold, and guiding packaging glue in for solidification to form a packaging glue layer, wherein the packaging glue layer is in a semi-solidified state; and E after demolding, coating the surface of the packaging glue layer with a protective layer. The inventionfurther provides the soft multi-core group ceramic capacitor. According to the invention, the number of the welding frame and the chips can be designed according to customer requirements, then the product appearance is reversely designed; the product appearance is enriched; the research and development period is greatly shortened; rapid mass production can be achieved; and extremely high shock resistance and environmental adaptability are achieved.

Description

technical field [0001] The invention relates to a soft multi-core group ceramic capacitor and a production method thereof. Background technique [0002] Traditional soft multi-core group ceramic capacitors are usually molded and packaged through packaging molds. However, the development cycle of molded packaging molds is long (usually 6-12 months) and expensive. Design the welding frame inside the capacitor, the number of ceramic capacitor chips, and the arrangement of the chips on the welding frame according to the external dimensions and specifications of the capacitor, which results in the defects of single product structure and long design and development cycle. Contents of the invention [0003] The purpose of the present invention is to address the deficiencies of the prior art, and propose a soft multi-core group ceramic capacitor and its production method, which can design the welding frame and the number of chips according to customer needs, and then reverse desig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G13/00H01G4/12H01G4/224H01G4/228H01G4/38
CPCH01G13/003H01G13/006H01G4/12H01G4/224H01G4/228H01G4/38
Inventor 朱江滨吴育东吴文辉吴明钊陈膺玺陈雅莹
Owner FUJIAN TORCH ELECTRON TECH CO LTD
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