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Ultra-thin vapor chamber and manufacturing process thereof

A vapor chamber and ultra-thin technology, applied in the field of heat conduction materials, can solve problems such as the limitation of heat dissipation efficiency, and achieve the effect of improved heat dissipation performance and reliable protection

Pending Publication Date: 2020-06-02
深圳威铂驰热技术有限公司
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Problems solved by technology

[0004] When the existing vapor chamber is made into an ultra-thin vapor chamber, its heat dissipation efficiency will be limited

Method used

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  • Ultra-thin vapor chamber and manufacturing process thereof
  • Ultra-thin vapor chamber and manufacturing process thereof

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specific Embodiment 1

[0029] An ultra-thin temperature chamber, comprising a cover plate 1, a bottom plate 3 and a porous capillary structure 2 arranged between them. The cover plate 1 is rectangular, and a plurality of cylindrical support columns 103 are fixed on the inner wall. The cover plate 1 acts as a sealing and heat dissipation surface. Heat dissipation. The shape of the base plate 3 is the same as that of the cover plate 1 , and a plurality of fastening portions 303 corresponding to the support columns 103 are provided on the inner sidewall of the base plate 3 . The cover plate 1 and the bottom plate 3 are made of copper and its copper alloy, iron, carbon steel, aluminum and its alloy or polymer materials such as Saigang, the thickness of the cover plate is 0.03-0.35mm, and the thickness of the bottom plate is 0.03-0.25mm; the supporting column has a diameter of 103 The longitudinal length is 0.2-1mm, mainly to strengthen the structural strength and the liquid return path.

[0030] One e...

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Abstract

The invention discloses an ultra-thin vapor chamber and a manufacturing process thereof. The vapor chamber comprises a cover plate, a bottom plate and a porous capillary structure arranged between thecover plate and the bottom plate; a plurality of supporting columns are fixedly connected to the inner side wall of the cover plate, and a plurality of buckling parts corresponding to the supportingcolumns are arranged on the inner side wall of the bottom plate; a first protruding part is fixedly arranged at the end of one side of the cover plate, and a first groove is formed in the inner wall of the first protruding part; a second protruding part is fixedly arranged at the end of one side of the bottom plate, a second groove is formed in the inner wall of the second protruding part, and a vacuumizing pipe / liquid injecting pipe is welded between the first groove and the second groove in a penetrating mode; and the porous capillary structure is a special-shaped porous capillary structure, and the porous capillary structure is in an asterisk shape or other shapes. According to the ultra-thin vapor chamber which is large and thin, when the total thickness of products is smaller than 0.4 mm, it is guaranteed that the saturated steam flowing space is increased by 30 %-50 %, and the overall heat dissipation performance can be improved by 30% or above.

Description

technical field [0001] The invention relates to the technical field of heat conduction materials, in particular to an ultra-thin uniform temperature plate and a manufacturing process thereof. Background technique [0002] With the advent of 5G, more and more consumers have put forward more and stronger functions for various electronic consumer devices, which not only leads to the increase of the electric power and heat dissipation power of these electronic devices, but also leads to the traditional graphite or copper foil The temperature control of the heating device cannot be controlled, resulting in poor user experience or short product life. For example, the user feels hot when holding the mobile phone, and crashes or frequency drops when using certain programs. Relevant foreign team research and statistics show that when similar problems occur, 96.3% of the problems are attributed to the overtemperature of the core device of the product, because the overtemperature of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 向军李建卫
Owner 深圳威铂驰热技术有限公司
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