Temperature control system and method for controlling temperature of device under test

Abstract

The invention discloses a temperature control system and method for controlling the temperature of a device under test, comprising a heating plate for heating the device under test; a temperature sensor for sensing the temperature of the heating plate; a cooling plate for heating the The plate is cooled, and the temperature of the cooling plate is lower than the temperature of the heating plate; the pushing device is connected with the cooling plate and used to control the movement of the cooling plate, and then controls the heat transfer rate between the cooling plate and the heating plate; the control system is connected with the temperature sensor Electric connection, and receive the signal of the temperature sensor, and then control the movement of the pushing device; the temperature sensor detects the temperature information of the heating plate, and the control system responds to the temperature information to control the movement of the pushing device, and then controls the temperature of the heating plate; controls the movement of the cooling plate through the pushing device , so as to control the heat conduction rate of the heating plate and the cooling plate, so as to achieve precise temperature control and good cooling effect.

Description

technical field [0001] The invention relates to the field of tested equipment, in particular to a temperature control system and method for controlling the temperature of the tested equipment. Background technique [0002] An integrated circuit is a miniature electronic device or component that interconnects transistors, resistors, capacitors, inductors and other components and wiring required in a circuit by a certain process, and is fabricated on a small or several small semiconductor chips or media. On the substrate, and then encapsulated in a tube shell, it becomes a microstructure with the required circuit function; the performance of integrated circuits is not static, and temperature is an important factor affecting the performance of integrated circuits. With the change of temperature, the performance of integrated circuits Conductivity, limit voltage, limit current, and switching characteristics will all change accordingly; therefore, it is necessary to test the temp...

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Problems solved by technology

[0003] Most of the existing test systems are equipped with a heating plate that is in direct contact with the DUT (device under test), and the heating plate is also equipped with a heater. There is a fixed cooling plate, and an evaporator is installed on one side of the cooling plate. The cooling plate is cooled by the evaporator, and then the temperature of the heating plate is lowered by using the cooling plate, so as to achieve the purpose of cooling the DUT; but the evaporators are all Cooling by refrigerant evaporation and heat absorption, such as the integrated circuit temperature control system mentioned in the patent application number 201410832160.2, uses Peltier elements to cool the heat-conducting silica gel, and the heat-conducting silica gel cools the integrated circuit. The cooling method not only has limited cooling capacity, but also is difficult to achieve the effect of strictly controlling the temperature of the DUT; therefore, the accurate temperature of the circuit board is particularly important for the working parameters (current, voltage) of the circuit board, and in conventional temperature tests, usually accompanied by With the change of humidity, if the humidity is too high, dew may condense on the circuit board, which will not only affect the accurate temperature of the circuit board, but also affect the tested working parameters of the circuit board

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