Temperature control system and method for controlling temperature of tested equipment

Abstract

The invention discloses a temperature control system and method for controlling the temperature of tested equipment. The system comprises a heating plate which is used for heating the tested equipment; a temperature sensor which is used for sensing the temperature of the heating plate; a cooling plate which is used for cooling the heating plate, wherein the temperature of the cooling plate is lower than that of the heating plate; a pushing device which is connected with the cooling plate and used for controlling the cooling plate to move so as to control the heat conduction rate between the cooling plate and the heating plate; and a control system which is electrically connected with the temperature sensor and receives signals of the temperature sensor so as to control the pushing device to move. When the temperature sensor obtains temperature information of the heating plate by detection, the control system responds to the temperature information to control the pushing device to moveso as to control the temperature of the heating plate; the pushing device controls the cooling plate to move, so that the heat conduction rate of the heating plate and the cooling plate is controlled,and the effects of accurately controlling the temperature and being good in refrigerating effect are achieved.

Description

technical field [0001] The invention relates to the field of tested equipment, in particular to a temperature control system and method for controlling the temperature of the tested equipment. Background technique [0002] An integrated circuit is a miniature electronic device or component that interconnects transistors, resistors, capacitors, inductors and other components and wiring required in a circuit by a certain process, and is fabricated on a small or several small semiconductor chips or media. On the substrate, and then encapsulated in a tube shell, it becomes a microstructure with the required circuit function; the performance of integrated circuits is not static, and temperature is an important factor affecting the performance of integrated circuits. With the change of temperature, the performance of integrated circuits Conductivity, limit voltage, limit current, and switching characteristics will all change accordingly; therefore, it is necessary to test the temp...

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Problems solved by technology

[0003] Most of the existing test systems are equipped with a heating plate that is in direct contact with the DUT (device under test). There is a fixed cooling plate, and an evaporator is installed on one side of the cooling plate. The cooling plate is cooled by the evaporator, and then the temperature of the heating plate is lowered by using the cooling plate, so as to achieve the purpose of cooling the DUT; but the evaporators are all Cooling by refrigerant evaporation and heat absorption, such as the integrated circuit temperature control system mentioned in the patent application number 201410832160.2, uses Peltier elements to cool the heat-conducting silica gel, and the heat-conducting silica gel cools the integrated circuit. The cooling method not only has limited cooling capacity, but also is difficult to achieve the effect of strictly controlling the DUT temperature; therefore, the accurate temperature of the circuit board is particularly important for the working parameters (current, voltage) of the circuit board, and in conventional temperature tests, usually accompanied by With the change of humidity, if the humidity is too high, dew may condense on the circuit board, which will not only affect the accurate temperature of the circuit board, but also affect the tested working parameters of the circuit board

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