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Spectrum dimming packaging structure and manufacturing method thereof

A packaging structure and dimming technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of mixed phosphor secondary absorption, low color rendering index, narrow luminous spectrum, etc., to avoid reabsorption, high quantum Efficiency, improve the effect of light effect

Active Publication Date: 2020-05-19
HAIDIKE NANTONG OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using shorter-wavelength blue or violet light to excite mixed phosphors can improve the excitation efficiency of cyan phosphors, but it increases the photon energy consumption of short-wavelength photons when exciting yellow and long-wavelength phosphors.
[0007] Second, there is also the problem of secondary absorption for mixed phosphors
Compared with multi-wavelength excitation, the emission spectrum of single-wavelength excitation light is narrower, and the color rendering index is lower, which cannot meet the needs of wide-spectrum high color rendering index
[0010] To sum up, at present, the main preparation methods of LED white light sources usually use dispensing, spraying, molding and other preparation processes, all of which are prepared by mixing various phosphors and silica gel evenly. The excitation and emission spectra of chips and phosphors obtained, so it is difficult to obtain LED white light sources with higher color rendering index under the same materials

Method used

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  • Spectrum dimming packaging structure and manufacturing method thereof
  • Spectrum dimming packaging structure and manufacturing method thereof
  • Spectrum dimming packaging structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] Make a spectral dimming package structure with a color temperature of 4000K:

[0101] The specification of the first wavelength blue-ray chip is 14*30mil, the wavelength λA is 465nm, the peak wavelength of the long-wavelength phosphor in the long-wavelength phosphor colloid layer and the colloid powder in the long-wavelength phosphor colloid layer is 620nm, and the glue weight The ratio is 1.7:1; the thickness of the long-wavelength phosphor colloid layer on the top surface of the first-wavelength blue-ray chip is 200 microns, and the thickness on the side of the first-wavelength blue-ray chip is 120 microns;

[0102] The specification of the second wavelength Blu-ray chip is 14*30mil, and the wavelength λB is 452nm;

[0103] The total number of chips in the entire spectral dimming package structure is 40 to 50. In this embodiment, the number of red powder packages is 22, and the number of second-wavelength blue light chips is 23. On the CIE chromaticity diagram, the re...

Embodiment 2

[0106] Make a spectrum dimming package structure with a color temperature of 3000K, which can be applied to the lighting of meat such as beef:

[0107] The specification of the first wavelength blue light chip is 14*30mil, and the wavelength λA is 465nm. The long-wavelength phosphor in the colloidal layer of the long-wavelength phosphor adopts mixed phosphor, among which, the weight of the red phosphor with a wavelength of 658-660nm is more than 70%, and the rest is For red phosphor with a wavelength of 627nm, the weight ratio of the long-wavelength phosphor to the colloid in the long-wavelength phosphor colloid layer is 3:1; the thickness of the long-wavelength phosphor colloid layer on the top surface of the first-wavelength blue chip is 200 microns, The thickness of the side of the blue light chip at the first wavelength is 120 microns;

[0108] The specification of the second wavelength Blu-ray chip is 14*30mil, and the wavelength λB is 452nm;

[0109] The total number of...

Embodiment 3

[0112] Make a spectrum dimming package structure with a color temperature of 6500K, which is applied to the lighting of seafood:

[0113] The specification of the first-wavelength blue light chip is 14*30mil, the wavelength λA is 465nm, and the long-wavelength phosphors in the long-wavelength phosphor colloid layer are all red powders with a peak wavelength of 620nm.

[0114] The weight ratio of the long-wavelength phosphor to the colloid in the colloidal layer of the long-wavelength phosphor is 0.2:1; The thickness is 120 microns;

[0115] The specification of the second wavelength Blu-ray chip is 14*30mil, and the wavelength λB is 452nm;

[0116] The total number of chips in the entire spectrum dimming package structure is about 30. In this embodiment, the number of red powder packages is 8, and the number of second-wavelength blue light chips is 20. On the CIE chromaticity diagram, the red powder package corresponds to the red The coordinates of the point are (0.43, 0.21)...

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Abstract

The invention relates to a spectrum dimming packaging structure. The invention also relates to a manufacturing method of the structure, the structure is characterized in that the structure comprises afirst wavelength blue light chip, a second wavelength blue light chip and a packaging layer, the surface of the first wavelength blue light chip is provided with a long wavelength fluorescent powderglue layer to form red powder packaging bodies in a CSP packaging form, and the packaging layer integrally packages the red powder packaging bodies and the second chip therein. The spectrum dimming packaging structure has the advantages that the color temperature can be changed by changing the ratio of the second chip to the red powder packaging body in the light source. Unlike a conventional packaging mode that fluorescent powder needs to be accurately weighed through a high-precision balance, and then the color temperature is changed by changing the mixing concentration of long-wavelength fluorescent powder in an overall packaging layer.

Description

technical field [0001] The invention relates to a spectral light-modulating packaging structure, and also relates to a manufacturing method of the spectral light-modulating packaging structure. Background technique [0002] The current white light LED generally has the following forms, such as figure 1 As shown in curve (1), blue light is used to excite a single yellow phosphor. In this case, the light efficiency is generally higher, but the display index is only about 70, and it is not suitable for low color temperature applications. When low-to-medium color temperature applications are required, long-wavelength phosphors are generally added. If it is necessary to further increase the color rendering index to more than 80, red and green phosphors need to be added at the same time. Such as figure 1 As shown in the curve (2), the color rendering index can reach 80 by using red and green phosphors at the same time. but from figure 1 It can be seen from curve (2) that in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/54
CPCH01L25/075H01L33/48H01L33/50H01L33/54Y02B20/00Y02P60/14
Inventor 孙智江王书昶吴陆吉爱华
Owner HAIDIKE NANTONG OPTOELECTRONICS TECH CO LTD
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