Heat-conducting gel with high heat conductivity and low oil output performance and preparation process thereof

Abstract

The invention relates to the technical field of heat-conducting interface materials for the intelligent communication industry, in particular to a heat-conducting gel with high heat conductivity and low oil output performance and a preparation process of the heat-conducting gel. The heat-conducting gel comprises the following components in parts by mass: 65-95 parts of a powder; 5-30 parts of silicone oil; 0.01 to 10 parts of a raw rubber; 0.1-5 parts of a curing agent; 0.1 to 3 parts of a coupling agent; and 0.5 to 1 part of a catalyst; wherein the powder is a mixture of aluminum oxide and zinc oxide powder; wherein the powder comprises, by mass, 60-95% of aluminum oxide; and 5%-40% of zinc oxide; in the powder, the particle size of aluminum oxide is 10-80 microns, and the particle size of zinc oxide is 1-10 microns. Theheat-conductinggel can form a uniform dispersion system, has high thermal conductivity and good fluidity; the heat dissipation efficiency of the heat-conducting gel isincreased greatly, the service life is prolonged greatly, anda strong practical value is achieved.

Description

technical field [0001] The invention relates to the technical field of heat-conducting interface materials used in the intelligent communication industry, in particular to a heat-conducting gel with high heat-conducting and low-oil-out performance and a preparation process thereof. Background technique [0002] With the rapid development of the smart phone industry, chipsets such as mobile phone CPU&GPU generate more and more heat. If the heat dissipation of the chipset is too slow and the temperature is too high, it is easy to reduce the function and life of the chipset of the mobile phone motherboard. Therefore, the heat dissipation of the motherboard chipset has undoubtedly become one of the important hot spots that mobile phone terminal manufacturers are particularly concerned about. [0003] For the heat dissipation of heat sources such as CPU&GPU chips, the most common method is to attach artificial graphite heat sinks on the metal shield of the chipset. However, ther...

AI Technical Summary

Problems solved by technology

The two-component thermally conductive gel has many disadvantages, such as a certain temperature change during curing, and the curing shrinkage rate is large, and the adhesion to the substrate is not good. It will gel quickly, so the operation time is longer, affecting production efficiency

The other is a single-component thermally conductive gel, which is between thermally conductive silicone grease and thermally conductive gaskets. One-component thermally conductive gel, but the selection and ratio of metal thermally conductive fillers in this technical solution are not good, resulting in high thermal resistance and thermal conductivity between 1.2-3.1, which cannot well meet the needs of use

Images