Low-volatility environment-friendly pickling-free soldering flux solution and preparation method and application thereof

A low-volatility, pickling-free technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of high saturated vapor pressure, high risk, low flash point, etc., achieve low saturated vapor pressure and wide application range , The effect of high boiling point of solvent

Active Publication Date: 2020-05-15
ZHEJIANG XINRUI WELDING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The problems in the above-mentioned patented technical solution are: because of the low boiling point of trimethyl borate and methanol solvent, high saturated vapor pressure and high methanol toxicity, the solvent is easy to volatilize and inhaled into the mouth and nose. If there is contact during use, methanol can contact the skin and enter , harmful to the environment and health
In addition, trimethyl borate and methanol solvents have low flash points, which belong to Class A liquids and are highly dangerous

Method used

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  • Low-volatility environment-friendly pickling-free soldering flux solution and preparation method and application thereof
  • Low-volatility environment-friendly pickling-free soldering flux solution and preparation method and application thereof
  • Low-volatility environment-friendly pickling-free soldering flux solution and preparation method and application thereof

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preparation example Construction

[0029] Each embodiment of the present invention and the flux solution preparation method of comparative example are similar, and concrete steps are:

[0030] (1) triethyl borate and ethanol are mixed with triethyl borate ethanol solution, or trimethyl borate and methanol are mixed with trimethyl borate methanol solution;

[0031] (2) add water to triethyl borate ethanol solution, or add water to trimethyl borate methanol solution;

[0032] (3) Selectively add boric acid, sodium tetraborate, potassium tetraborate, potassium fluoride, potassium chloride and cesium fluoride as active elements to the mixed solution obtained in step (2) and dissolve to obtain a flux solution.

[0033] In the brazing test process of each embodiment of the present invention and the comparative example, except that the flux solution is different, other conditions (such as the amount of flux, the amount of solder, etc.) are the same.

Embodiment 1

[0035] Low-volatility pickling-free flux solution, according to the mass ratio of triethyl borate 30%, ethanol 47%, water 14%, boric acid 6%, sodium tetraborate 2%, potassium fluoride 0.5%, potassium chloride 0.5% . According to GB / T11363-2008 "Brazed Joint Strength Test Method", T2 red copper plate and H62 brass plate were used as the test base material, and the commercially available B-Cu93P solder was used as the test solder. Compared with that, after using the low-volatility pickling-free flux solution of this embodiment, the effective brazing area is increased by 15% and 16.5% respectively.

Embodiment 2

[0037] Low-volatility pickling-free flux solution, according to the mass ratio of triethyl borate 45%, ethanol 32%, water 14%, boric acid 6%, sodium tetraborate 1%, potassium tetraborate 1%, potassium fluoride 0.8% , Cesium fluoride 0.2%. According to GB / T11363-2008 "Brazed Joint Strength Test Method", T2 red copper plate and H62 brass plate were used as the test base material, and the commercially available B-Cu93P solder was used as the test solder. Compared with that, after using the low-volatility pickling-free flux solution of this embodiment, the effective brazing area is increased by 17.5% and 18% respectively.

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Abstract

The invention discloses a low-volatility environment-friendly pickling-free soldering flux solution and application of the low-volatility environment-friendly pickling-free soldering flux solution inflame soldering, high-frequency soldering or furnace soldering. The low-volatility environment-friendly pickling-free soldering flux solution comprises, by weight: 30%-50% of triethyl borate, 25%-50%of ethanol, 12%-16% of water, 0%-6% of boric acid, 0%-3% of sodium tetraborate, 0%-3% of potassium tetraborate, 0%-2% of potassium fluoride, 0%-2% of potassium chloride and 0%-1% of cesium fluoride. The invention also discloses a preparation method of the low-volatility environment-friendly pickling-free soldering flux solution. The preparation method comprises the steps of preparing a triethyl borate ethanol solution from the triethyl borate and the ethanol, adding the water into the triethyl borate ethanol solution, and then selectively adding the boric acid, the sodium tetraborate, the potassium tetraborate, the potassium fluoride, the potassium chloride and the cesium fluoride as active elements to dissolve to obtain the low-volatility environment-friendly pickling-free soldering fluxsolution.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a low-volatility environment-friendly pickling-free flux solution and its preparation method and application. Background technique [0002] Welding is one of the important processes in industrial product processing. Flux is an auxiliary material used in welding, which can help and promote welding in the welding process. The main function of the flux is to remove the oxides on the surface of the solder and the base metal to be welded, so that the metal surface can reach the necessary cleanliness, prevent the surface from re-oxidizing during welding, reduce the surface tension of the solder, and improve the welding performance. [0003] The traditional pickling-free flux is usually trimethyl borate and methanol as solvent. [0004] For example, the patent specification whose publication number is CN 101380705A discloses a high-activity no-cleaning flux, the ratio by mass...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/362
CPCB23K35/362
Inventor 金海斌娄银斌钱似舰
Owner ZHEJIANG XINRUI WELDING MATERIAL
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