Spliced printed circuit substrate structure

Abstract

The invention relates to the technical field of printed circuit substrates, and discloses a spliced printed circuit substrate structure. First screw holes are formed in the corners of the upper surfaces of a first substrate and a second substrate correspondingly. A base material layer, a circuit layer and an insulating layer are sequentially adhered to the interiors of the first substrate and thesecond substrate from inside to outside; heat dissipation assemblies are embedded in the edges of the upper surfaces of the first substrate and the second substrate correspondingly, a connecting assembly is further connected between the first substrate and the second substrate, and clamping assemblies are connected to the positions, close to the two sides of the connecting assembly, between the first substrate and the second substrate correspondingly. The clamping assembly and the connecting assembly are combined for use; by means of the clamping assembly, a user can conveniently splice the first substrate and the second substrate and conveniently use the first substrate and the second substrate according to actual use requirements, the splicing stability between the first substrate and the second substrate can be improved through the clamping assembly, and the first substrate and the second substrate are not prone to falling off or loosening after being spliced.

Description

Technical field [0001] The invention relates to the technical field of printed circuit substrates, in particular to a spliced ​​printed circuit substrate structure. Background technique [0002] Circuit printing adopts photo-engraving technology, that is, the base plate of the photographed picture is etched on a copper plate or a zinc plate. This type of copper plate or zinc plate is used for printing, which has made significant progress compared with the traditional circuit board, and the substrate is made of PCB. The basic material, under normal circumstances, the substrate is a copper clad laminate. Single and double-sided printed boards are manufactured on the substrate material-copper clad laminate, with selective hole processing, electroless copper plating, and copper electroplating , Etching and other processing to obtain the required circuit pattern. [0003] However, the existing substrate structure is not easy to splice and cannot meet actual use needs. Moreover, the exi...

AI Technical Summary

Problems solved by technology

[0003] However, the existing substrate structure is not easy to splice and cannot meet the actual needs of use. Moreover, the existing substrate structure is not easy to dissipate heat, and its internal components are easily damaged by high temperature.

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