Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Crimping type IGBT thermal network model modeling method and related device

A technology of a thermal network model and a modeling method, which is applied in the field of crimping IGBT thermal network model modeling, can solve the problems that the IGBT thermal network model cannot be calculated and the calculation accuracy of the IGBT temperature distribution information is not high, so as to ensure the accuracy and improve the The effect of computational precision

Active Publication Date: 2020-05-08
GUANGDONG POWER GRID CO LTD +1
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a method for modeling the thermal network model of a press-connect type IGBT and related devices, which solves the problem that the IGBT thermal network model established by the thermal group parameters in the data book in the prior art cannot be calculated to obtain the IGBT thermal network model. The temperature distribution information of each layer and the technical problem of low calculation accuracy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Crimping type IGBT thermal network model modeling method and related device
  • Crimping type IGBT thermal network model modeling method and related device
  • Crimping type IGBT thermal network model modeling method and related device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] In order to make those skilled in the art better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only It is a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0050] For ease of understanding, see figure 1 , an embodiment of a method for modeling a crimp-type IGBT thermal network model provided by this application includes:

[0051] Step 101 , constructing a three-dimensional model of the solid crimp IGBT based on the solid crimp IGBT.

[0052] It should be noted that 3D m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a crimping type IGBT thermal network model modeling method and a related device. The method includes: constructing a three-dimensional model based on the entity crimping type IGBT, importing the three-dimensional model into finite element simulation software, setting temperature monitoring points at key nodes of each layer of the crimping type IGBT of the three-dimensionalmodel, setting boundary conditions in the finite element simulation software, and enabling the finite element simulation software to output maximum junction temperature, temperature information of thetemperature monitoring points and thermal power; when the difference value between the maximum junction temperature and the junction temperature measured according to the entity crimping type IGBT issmaller than a preset threshold value, calculating and obtaining a transient thermal impedance curve according to the temperature information and the thermal power; carrying out data fitting on the curve to obtain heat group parameters; and establishing the crimping type IGBT thermal network model. The technical problems that in the prior art, the IGBT thermal network model is established throughthe thermal group parameters of the data manual, so that the IGBT thermal network model cannot calculate the temperature distribution information of each layer of the IGBT, and the calculation precision is not high are solved.

Description

technical field [0001] The present application relates to the technical field of IGBTs, and in particular, to a method for modeling a thermal network model of a crimp IGBT and a related device. Background technique [0002] Due to its high reliability and short-circuit characteristics after failure, crimp IGBTs are increasingly used in power conversion fields such as flexible DC transmission MMC modules and electric vehicles. [0003] The inside of the crimp IGBT is a layered structure composed of chips and metal, which is pressed by external pressure during operation to ensure the reliable electrical connection between the layers. The power loss of the crimp IGBT will occur during the operation. The power loss is mainly composed of two parts, one is the conduction loss and the other is the switching loss. The conduction loss is the loss caused by the large current flowing through the crimp IGBT in the on state. The greater the current, the greater the voltage drop between ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/23G06F111/10
Inventor 张健余超耘
Owner GUANGDONG POWER GRID CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com